公开(公告)号：US20180184544A1

公开(公告)日：2018-06-28

申请号：US15724349

申请日：2017-10-04

Applicant: Eaton Corporation

Inventor： James Gerard Maloney ,  James Lee Gehlbach

IPC: H05K7/20 ,  H02B1/21 ,  H02B1/06 ,  H02G3/14 ,  F28F21/08 ,  H02B1/056 ,  F28F21/04

CPC classification number: H05K7/2039 ,  F28F21/04 ,  F28F21/084 ,  F28F21/085 ,  H02B1/056 ,  H02B1/06 ,  H02B1/21 ,  H02B1/56 ,  H02G3/14 ,  H05K2201/10272

Abstract: Thermally conductive assemblies that provide a heat conduction path include at least one thermally conductive wedge block that can be held in a receptacle with a wall having sufficient flexibility to be able to expand outward in response to an outward force applied by the at least one thermally conductive wedge block. The wedge block can also be electrically resistive.