公开(公告)号：US08691422B2

公开(公告)日：2014-04-08

申请号：US13688089

申请日：2012-11-28

Applicant: Electronvault, Inc.

Inventor： Robert R. Ferber, Jr.

IPC: H01M2/24

CPC classification number: H01R12/00 ,  H01L31/0504 ,  H01M2/202 ,  H01M2/348 ,  H01M8/0202 ,  H01M10/4235 ,  H01M2200/10 ,  H01R11/30 ,  H05K1/189 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/083 ,  H05K2201/10037 ,  H05K2201/10143 ,  Y02E10/50

Abstract: A modular interconnection system in the form of a releasable modular interconnect is provided. The releasable modular interconnect may include a substrate with a plurality of releasable contact regions, where each releasable contact region may be positioned to overlay a respective terminal of a power cell. The releasable modular interconnect may also include at least one conductive interconnect member affixed to the substrate, where the conductive interconnect member includes at least a one conductive releasable contact disposed within a releasable contact region of the substrate. The conductive releasable contact may be positioned to form a releasable electrical connection with a terminal of a power cell when a force is applied to the first releasable contact region in a direction toward the terminal of the power cell. Additional and related methods and apparatuses are also provided.

Abstract translation: 提供了可释放模块化互连形式的模块化互连系统。 可释放的模块化互连可以包括具有多个可释放接触区域的基板，其中每个可释放的接触区域可以被定位成覆盖功率单元的相应端子。 可释放的模块化互连还可以包括固定到衬底的至少一个导电互连构件，其中导电互连构件包括设置在衬底的可释放接触区域内的至少一个导电可释放触点。 当向朝向动力单元的端子的方向向第一可释放接触区域施加力时，导电可释放接触件可被定位成与功率单元的端子形成可释放的电连接。 还提供了附加的和相关的方法和装置。