公开(公告)号：US11307125B2

公开(公告)日：2022-04-19

申请号：US16196145

申请日：2018-11-20

Applicant: FEMTOTOOLS AG

Inventor： David Beyeler ,  Simon Muntwyler ,  Felix Beyeler

IPC: G01N3/42 ,  G01Q60/36

Abstract: A MEMS-nanoindenter chip performs nanoindentation on a specimen. The MEMS-nanoindenter chip has an intender probe joined with an indenter tip. The indenter tip indents into the specimen. A reference probe is joined with a reference tip, the reference tip touches the specimen. Sensing capabilities are provided to measure the position of the indenter probe relative to the reference probe. The MEMS-nanoindenter chip enables highly accurate measurements since the frame stiffness is not part of the measurement chain any more. Furthermore, thermal drift during the nanoindentation is considerably reduced.

公开(公告)号：US09575093B2

公开(公告)日：2017-02-21

申请号：US14516793

申请日：2014-10-17

Applicant: FEMTOTOOLS AG

Inventor： Felix Beyeler ,  Christoph Bolliger ,  Daniel Frost ,  David Beyeler ,  Simon Muntwyler

IPC: G01R31/20 ,  G01R1/04 ,  B81C99/00 ,  G01D5/12 ,  G01L1/18 ,  G01L3/02 ,  G01R1/44 ,  G01R31/00

CPC classification number: G01R1/0408 ,  B81C99/005 ,  G01D5/12 ,  G01L1/18 ,  G01L3/02 ,  G01R1/44 ,  G01R31/00

Abstract: A system for testing MEMS-structures includes a microforce sensor, two or more multi-axis micropositioning units, at least one electrical probe and a sample holder on which a MEMS-structure is mounted. At least one of the multi-axis micropositioning units is motorized and at least one additional micropositioning unit is equipped with at least one electrical probe to apply electrical signals or to measure electrical signals at one or multiple locations on the MEMS structure. The system with the aforementioned components allows a combined electrical and probe-based mechanical testing of MEMS-structures.

Abstract translation: 用于测试MEMS结构的系统包括微力传感器，两个或多个多轴微定位单元，至少一个电探针和其上安装有MEMS结构的样品架。 多轴微定位单元中的至少一个被电动化，并且至少一个附加的微定位单元配备有至少一个电探针以施加电信号或在MEMS结构上的一个或多个位置处测量电信号。 具有上述组件的系统允许对MEMS结构进行组合电和基于探针的机械测试。