FINGERPRINT SENSOR MODULE FOR A SMARTCARD AND METHOD FOR FINGERPRINT RECOGNITION IN A SMARTCARD

    公开(公告)号:US20240127621A1

    公开(公告)日:2024-04-18

    申请号:US18547713

    申请日:2022-02-17

    Inventor: Mats Slottner

    CPC classification number: G06V40/1306 G06K19/07354 H04B5/73

    Abstract: A fingerprint sensor module for a smartcard, the fingerprint sensor module comprising: a first substrate; a fingerprint sensing device mounted on a first side of the first substrate, the fingerprint sensing device having a sensing surface facing in a first direction of the fingerprint sensor module; a second substrate arranged on a second side of the first substrate, opposite the first side, the second substrate comprising a contact area having a plurality of terminal contact pads configured to connect the fingerprint sensor module to an external terminal, the terminal contact pads facing a second direction of the fingerprint sensor module, opposite the first direction; and wherein the contact area comprises at least one finger contact pad configured to provide a potential to a finger in contact with the finger contact pad during fingerprint image capture.

    BIOMETRIC IMAGING MODULE AND METHOD FOR MANUFACTURING A BIOMETRIC IMAGING MODULE

    公开(公告)号:US20230206017A1

    公开(公告)日:2023-06-29

    申请号:US17928341

    申请日:2021-06-23

    CPC classification number: G06K19/0718 G06V40/1318 G06K19/07722

    Abstract: Method for manufacturing a biometric imaging module, the method comprising: providing a carrier tape; forming a sensor opening and at least one contact pad opening in the carrier tape, wherein the sensor opening is adjacent to the contact pad opening; and from a top side of the carrier tape, arranging a biometric sensor on the carrier tape such that a body of the biometric sensor is arranged in the sensor opening and a conductive contact pad of the biometric sensor is aligned with and accessible through the contact pad opening from a backside of the carrier tape, and such that a sensing surface of the biometric sensor is facing in the same direction as the top side of the carrier tape.

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