公开(公告)号：US20180372956A1

公开(公告)日：2018-12-27

申请号：US16014998

申请日：2018-06-21

Applicant: FINISAR CORPORATION

Inventor： Jiashu Chen ,  Yuxin Zhou

IPC: G02B6/26 ,  F21V8/00 ,  G02B6/42 ,  G02B6/38 ,  H05K1/18

Abstract: An optical coupling system includes a first waveguide that includes a first waveguide end, a second waveguide end. The optical coupling system includes a first lens that is aligned with a first optical fiber. The optical coupling system includes a first lens holder that retains the first lens. The lens holder includes a waveguide retention portion on which the first waveguide end is positioned such that the first waveguide end is aligned with the first lens. The optical coupling system includes a second lens that is aligned with a first optical component. The optical coupling system includes a second lens holder that retains the second lens. The second lens holder includes a waveguide retention portion on which the second waveguide end is positioned such that the second waveguide end is aligned with the second lens.

公开(公告)号：US09946028B2

公开(公告)日：2018-04-17

申请号：US15382373

申请日：2016-12-16

Applicant: Finisar Corporation

Inventor： Jiashu Chen ,  Steve Macica ,  Idan Mizrahi

IPC: G02B6/36 ,  G02B6/30 ,  G02B6/32 ,  G02B6/42 ,  G02B6/43

CPC classification number: G02B6/30 ,  G02B6/322 ,  G02B6/4249 ,  G02B6/4292 ,  G02B6/43

Abstract: A guide pin wafer may include a base wafer that includes multiple dies. Each die may include a corresponding lens cutout. The guide pin wafer may also include multiple guide pins mounted on the base wafer. Each die of the base wafer may be mounted with two or more corresponding guide pins that may be configured to engage a parallel fiber connector to the corresponding die.

公开(公告)号：US20170176686A1

公开(公告)日：2017-06-22

申请号：US15382373

申请日：2016-12-16

Applicant: Finisar Corporation

Inventor： Jiashu Chen ,  Steve Macica ,  Idan Mizrahi

IPC: G02B6/32

CPC classification number: G02B6/30 ,  G02B6/322 ,  G02B6/4249 ,  G02B6/4292 ,  G02B6/43

Abstract: A guide pin wafer may include a base wafer that includes multiple dies. Each die may include a corresponding lens cutout. The guide pin wafer may also include multiple guide pins mounted on the base wafer. Each die of the base wafer may be mounted with two or more corresponding guide pins that may be configured to engage a parallel fiber connector to the corresponding die.

公开(公告)号：US10690857B2

公开(公告)日：2020-06-23

申请号：US16014998

申请日：2018-06-21

Applicant: FINISAR CORPORATION

Inventor： Jiashu Chen ,  Yuxin Zhou

IPC: G02B6/42 ,  G02B6/30

Abstract: An optical coupling system includes a first waveguide that includes a first waveguide end, a second waveguide end. The optical coupling system includes a first lens that is aligned with a first optical fiber. The optical coupling system includes a first lens holder that retains the first lens. The lens holder includes a waveguide retention portion on which the first waveguide end is positioned such that the first waveguide end is aligned with the first lens. The optical coupling system includes a second lens that is aligned with a first optical component. The optical coupling system includes a second lens holder that retains the second lens. The second lens holder includes a waveguide retention portion on which the second waveguide end is positioned such that the second waveguide end is aligned with the second lens.

公开(公告)号：US20180149820A1

公开(公告)日：2018-05-31

申请号：US15826119

申请日：2017-11-29

Applicant: FINISAR CORPORATION

Inventor： Jiashu Chen

IPC: G02B6/43 ,  G02B6/04 ,  G02B6/42

CPC classification number: G02B6/43 ,  G02B6/04 ,  G02B6/3644 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/4249

Abstract: An optical coupling assembly includes optical fibers and a fiber coupling structure assembly that includes an active optical component (AOC) array. The AOC array includes wafer material, AOCs, and soldering pads. The fiber coupling structure assembly includes a rigid substrate that defines apertures and includes an array connection surface on which additional soldering pads are formed. The rigid substrate is fixed to the AOC array by bump joints that connect the soldering pads of the AOC array with the additional soldering pads formed on the array connection surface such that each of the apertures is aligned with a corresponding one of the AOCs. The optical fibers may be positioned relative to the one or more apertures such that an optical signal may be communicated between a corresponding one of the optical fibers and a corresponding one of the AOCs via a corresponding one of the one or more apertures.

公开(公告)号：US10302883B2

公开(公告)日：2019-05-28

申请号：US15826119

申请日：2017-11-29

Applicant: FINISAR CORPORATION

Inventor： Jiashu Chen

IPC: G02B6/26 ,  G02B6/43 ,  G02B6/42 ,  G02B6/04 ,  G02B6/36

Abstract: An optical coupling assembly includes optical fibers and a fiber coupling structure assembly that includes an active optical component (AOC) array. The AOC array includes wafer material, AOCs, and soldering pads. The fiber coupling structure assembly includes a rigid substrate that defines apertures and includes an array connection surface on which additional soldering pads are formed. The rigid substrate is fixed to the AOC array by bump joints that connect the soldering pads of the AOC array with the additional soldering pads formed on the array connection surface such that each of the apertures is aligned with a corresponding one of the AOCs. The optical fibers may be positioned relative to the one or more apertures such that an optical signal may be communicated between a corresponding one of the optical fibers and a corresponding one of the AOCs via a corresponding one of the one or more apertures.