公开(公告)号：US20180198254A1

公开(公告)日：2018-07-12

申请号：US15867546

申请日：2018-01-10

Applicant: FINISAR CORPORATION

Inventor： Jimmy Alan Tatum ,  James K. Guenter

IPC: H01S5/026 ,  H01S5/183 ,  H01S5/42 ,  H01S5/022

CPC classification number: H01S5/026 ,  G02B3/0043 ,  G02B5/021 ,  G02B27/0905 ,  G02B27/0927 ,  G02B27/0944 ,  G02B27/0961 ,  H01S5/0226 ,  H01S5/183 ,  H01S5/18391 ,  H01S5/423

Abstract: An embodiment includes a light source. The light source may include a substrate and an integrated diffuser. The substrate may include a first surface and a second surface. The second surface may be opposite the first surface. The integrated diffuser may be integrated at the chip-level and positioned directly on the second surface of the substrate. The integrated diffuser may be configured to receive an optical signal directly from the substrate after the optical signal propagates through the substrate and to control a particular profile of a resultant beam of the optical signal over two axes after the optical signal propagates through the integrated diffuser.

公开(公告)号：US09515746B2

公开(公告)日：2016-12-06

申请号：US14500212

申请日：2014-09-29

Applicant: FINISAR CORPORATION

Inventor： Frank J. Flens ,  Daniel Mahgerefteh ,  The′ Linh Nguyen ,  Jimmy Alan Tatum

IPC: H04B10/00 ,  H04B10/80

CPC classification number: H04B10/40 ,  H04B10/502 ,  H04B10/801

Abstract: An optically enabled multi-chip module has an optical engine transceiver and a host system chip. The optical engine transceiver has an optical engine front-end and an optical engine macro. The optical engine front-end has multiple laser diodes, laser driver circuitry electrically interfaced with each of the laser diodes, multiple photodiodes, amplifier circuitry electrically interfaced with each of the photodiodes, and at least one optical element optically positioned between the laser diodes and at least one optical fiber and between the photodiodes and the at least one optical fiber. The at least one optical element optically interfaces the laser diodes and photodiodes with the optical fiber. The optical engine macro is both electrically interfaced with and physically segregated from the optical engine front-end. The optical engine macro provides a subset of optical transceiver functionality to the optical engine front-end. The host system chip is electrically interfaced with the optical engine transceiver.

Abstract translation: 光学启用的多芯片模块具有光学引擎收发器和主机系统芯片。 光引擎收发器具有光引擎前端和光引擎宏。 光学引擎前端具有多个激光二极管，与每个激光二极管电连接的激光驱动器电路，多个光电二极管，与每个光电二极管电连接的放大器电路，以及光学定位在激光二极管之间的至少一个光学元件 至少一个光纤，并且在所述光电二极管和所述至少一个光纤之间。 所述至少一个光学元件将激光二极管和光电二极管与光纤光学接口。 光学引擎宏与光引擎前端电接口并与之物理隔离。 光学引擎宏为光引擎前端提供光收发器功能的子集。 主机系统芯片与光引擎收发器电接口。

公开(公告)号：US10594402B2

公开(公告)日：2020-03-17

申请号：US15369770

申请日：2016-12-05

Applicant: FINISAR CORPORATION

Inventor： Frank J. Flens ,  Daniel Mahgerefteh ,  The' Linh Nguyen ,  Jimmy Alan Tatum

IPC: H04B10/40 ,  H04B10/80 ,  H04B10/50

Abstract: An optically enabled multi-chip module has an optical engine transceiver and a host system chip. The optical engine transceiver has an optical engine front-end and an optical engine macro. The optical engine front-end has multiple laser diodes, laser driver circuitry electrically interfaced with each of the laser diodes, multiple photodiodes, amplifier circuitry electrically interfaced with each of the photodiodes, and at least one optical element optically positioned between the laser diodes and at least one optical fiber and between the photodiodes and the at least one optical fiber. The at least one optical element optically interfaces the laser diodes and photodiodes with the optical fiber. The optical engine macro is both electrically interfaced with and physically segregated from the optical engine front-end. The optical engine macro provides a subset of optical transceiver functionality to the optical engine front-end. The host system chip is electrically interfaced with the optical engine transceiver.

公开(公告)号：US20170237496A1

公开(公告)日：2017-08-17

申请号：US15369770

申请日：2016-12-05

Applicant: FINISAR CORPORATION

Inventor： Frank J. Flens ,  Daniel Mahgerefteh ,  The' Linh Nguyen ,  Jimmy Alan Tatum

IPC: H04B10/40 ,  H04B10/50 ,  H04B10/80

CPC classification number: H04B10/40 ,  H04B10/502 ,  H04B10/801

Abstract: An optically enabled multi-chip module has an optical engine transceiver and a host system chip. The optical engine transceiver has an optical engine front-end and an optical engine macro. The optical engine front-end has multiple laser diodes, laser driver circuitry electrically interfaced with each of the laser diodes, multiple photodiodes, amplifier circuitry electrically interfaced with each of the photodiodes, and at least one optical element optically positioned between the laser diodes and at least one optical fiber and between the photodiodes and the at least one optical fiber. The at least one optical element optically interfaces the laser diodes and photodiodes with the optical fiber. The optical engine macro is both electrically interfaced with and physically segregated from the optical engine front-end. The optical engine macro provides a subset of optical transceiver functionality to the optical engine front-end. The host system chip is electrically interfaced with the optical engine transceiver.

公开(公告)号：US11353634B2

公开(公告)日：2022-06-07

申请号：US16884329

申请日：2020-05-27

Applicant: FINISAR CORPORATION

Inventor： Jimmy Alan Tatum ,  James K Guenter

IPC: G02B5/02 ,  H01S5/026 ,  H01S5/42 ,  H01S5/183 ,  G02B27/09 ,  G02B3/00 ,  H01S5/0236

Abstract: An embodiment includes a light source. The light source may include a substrate and a diffuser. The substrate may include a first surface and a second surface. The second surface may be opposite the first surface. The diffuser may be carried by the substrate. The diffuser may be configured to receive an optical signal from the substrate after the optical signal propagates through the substrate and to control a particular profile of a resultant beam of the optical signal over two axes after the optical signal propagates through the integrated diffuser.

公开(公告)号：US20150090864A1

公开(公告)日：2015-04-02

申请号：US14500212

申请日：2014-09-29

Applicant: FINISAR CORPORATION

Inventor： Frank J. Flens ,  Daniel Mahgerefteh ,  The' Linh Nguyen ,  Jimmy Alan Tatum

IPC: H04B10/40

CPC classification number: H04B10/40 ,  H04B10/502 ,  H04B10/801

Abstract: An optically enabled multi-chip module has an optical engine transceiver and a host system chip. The optical engine transceiver has an optical engine front-end and an optical engine macro. The optical engine front-end has multiple laser diodes, laser driver circuitry electrically interfaced with each of the laser diodes, multiple photodiodes, amplifier circuitry electrically interfaced with each of the photodiodes, and at least one optical element optically positioned between the laser diodes and at least one optical fiber and between the photodiodes and the at least one optical fiber. The at least one optical element optically interfaces the laser diodes and photodiodes with the optical fiber. The optical engine macro is both electrically interfaced with and physically segregated from the optical engine front-end. The optical engine macro provides a subset of optical transceiver functionality to the optical engine front-end. The host system chip is electrically interfaced with the optical engine transceiver.

Abstract translation: 光学启用的多芯片模块具有光学引擎收发器和主机系统芯片。 光引擎收发器具有光引擎前端和光引擎宏。 光学引擎前端具有多个激光二极管，与每个激光二极管电连接的激光驱动器电路，多个光电二极管，与每个光电二极管电连接的放大器电路，以及光学定位在激光二极管之间的至少一个光学元件 至少一个光纤，并且在所述光电二极管和所述至少一个光纤之间。 所述至少一个光学元件将激光二极管和光电二极管与光纤光学接口。 光学引擎宏与光引擎前端电接口并与之物理隔离。 光学引擎宏为光引擎前端提供光收发器功能的子集。 主机系统芯片与光引擎收发器电接口。

公开(公告)号：US20200313385A1

公开(公告)日：2020-10-01

申请号：US16884329

申请日：2020-05-27

Applicant: FINISAR CORPORATION

Inventor： Jimmy Alan Tatum ,  James K. Guenter

IPC: H01S5/026 ,  H01S5/022 ,  H01S5/42 ,  H01S5/183 ,  G02B5/02 ,  G02B27/09 ,  G02B3/00

Abstract: An embodiment includes a light source. The light source may include a substrate and a diffuser. The substrate may include a first surface and a second surface. The second surface may be opposite the first surface. The diffuser may be carried by the substrate. The diffuser may be configured to receive an optical signal from the substrate after the optical signal propagates through the substrate and to control a particular profile of a resultant beam of the optical signal over two axes after the optical signal propagates through the integrated diffuser.

公开(公告)号：US10714892B2

公开(公告)日：2020-07-14

申请号：US15867546

申请日：2018-01-10

Applicant: FINISAR CORPORATION

Inventor： Jimmy Alan Tatum ,  James K Guenter

IPC: H01S5/026 ,  H01S5/022 ,  H01S5/42 ,  H01S5/183 ,  G02B5/02 ,  G02B3/00 ,  G02B27/09

Abstract: An embodiment includes a light source. The light source may include a substrate and an integrated diffuser. The substrate may include a first surface and a second surface. The second surface may be opposite the first surface. The integrated diffuser may be integrated at the chip-level and positioned directly on the second surface of the substrate. The integrated diffuser may be configured to receive an optical signal directly from the substrate after the optical signal propagates through the substrate and to control a particular profile of a resultant beam of the optical signal over two axes after the optical signal propagates through the integrated diffuser.