公开(公告)号：US11546974B2

公开(公告)日：2023-01-03

申请号：US17072337

申请日：2020-10-16

Applicant: FORMOSA TAFFETA CO., LTD.

Inventor： Fang-Jong Liu ,  Hsing-Nan Chung ,  Meng-Yueh Wu

IPC: H05K1/09 ,  H05K9/00 ,  H01M4/32 ,  H01M4/52 ,  H01M4/64 ,  H01M4/66 ,  H01M4/70 ,  H01M4/74 ,  H01M4/505 ,  H01M4/525 ,  H01M4/583 ,  H05B3/34 ,  H05K1/03 ,  H05K3/18

Abstract: The present invention provides a conductive fabric comprising base cloth and a conductive metallic circuit structure formed on the surface of the base cloth. The conductive metallic circuit structure comprises at least one metallic seed layer and at least one chemical-plating layer. The metallic seed layer is an evaporation-deposition layer or a sputter-deposition layer and has a circuit pattern. The chemical-plating layer is applied over the surface of the metallic seed layer. The conductive fabric has improved conductivity and heat generation efficiency.

公开(公告)号：US20210120634A1

公开(公告)日：2021-04-22

申请号：US17072337

申请日：2020-10-16

Applicant: FORMOSA TAFFETA CO., LTD.

Inventor： Fang-Jong Liu ,  Hsing-Nan Chung ,  Meng-Yueh Wu

IPC: H05B3/34 ,  H05K1/03 ,  H05K3/18

Abstract: The present invention provides a conductive fabric comprising base cloth and a conductive metallic circuit structure formed on the surface of the base cloth. The conductive metallic circuit structure comprises at least one metallic seed layer and at least one chemical-plating layer. The metallic seed layer is an evaporation-deposition layer or a sputter-deposition layer and has a circuit pattern. The chemical-plating layer is applied over the surface of the metallic seed layer. The conductive fabric has improved conductivity and heat generation efficiency.