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公开(公告)号:US20200040119A1
公开(公告)日:2020-02-06
申请号:US16177773
申请日:2018-11-01
Applicant: Fudan University
Inventor: Hai DENG , Chenxu WANG , Zhilong LI , Xuemiao LI
IPC: C08F293/00 , C08F212/14 , C08F220/18 , C08F230/08
Abstract: The present invention discloses a block copolymer comprising at least a block A and a block B, wherein the monomer of block A contains one or more of the structural units: a C3-C6 alkenyl group containing a substituent or a C3-C6 alkenyl group; wherein the number of R1 is 0, 1, 2, 3, 4 or 5; R2 is selected from the group consisting of: absent, substituted or unsubstituted C1-C6 alkyl, substituted or unsubstituted C1-C6 alkoxyl, hydroxyl, halogen; “substituted” means a group is substituted by one or more substituents selected from halogen and hydroxyl; block B is obtained by polymerization of the monomer R6 is selected from F or a group containing F, and the number of R6 is 0, 1, 2, 3, 4 or 5. The block copolymer can assemble rapidly at a low temperature with self-repairing performance to reduce the defect rate.
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公开(公告)号:US20180208697A1
公开(公告)日:2018-07-26
申请号:US15614211
申请日:2017-06-05
Applicant: FUDAN UNIVERSITY
Inventor: Hai DENG , Xuemiao LI , Jie LI
IPC: C08F293/00 , C07C69/653
CPC classification number: C08F293/00 , C07C69/653 , C08F297/026
Abstract: The present invention relates to a rapid assembled small-sized block polymer material with low quenching temperature and the preparation and application thereof. In particular, the present invention discloses a block copolymer, and glass transition temperature of the block copolymer is less than 120° C. The present invention also discloses the preparation and application of the block copolymer. The block copolymer can achieve excellent phase separation and rapid patterning at a lower annealing temperature (e.g. 80° C.) and a shorter annealing time (e.g. 30 s), and a photolithographic pattern with a very high resolution (e.g. 5 nm half-pitch) can be further obtained by etching, which provides a new photolithographic mean for further extension of Moore's Law to achieve semiconductor photolithography with a resolution of less than 10 nm, or even 5 nm (half-pitch).
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