公开(公告)号：US20150359103A1

公开(公告)日：2015-12-10

申请号：US14759459

申请日：2013-02-08

Applicant: FUJIKURA LTD.

Inventor： Yoshinori SANO ,  Masahiro OKAMOTO

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/40 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/185 ,  H01L23/13 ,  H01L23/145 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/73267 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/186 ,  H05K3/002 ,  H05K3/0032 ,  H05K3/4038 ,  H05K3/427 ,  H05K3/4697 ,  H05K2201/09818 ,  H05K2203/061

Abstract: Provided is a component-embedded board which includes: a first board including a first insulation layer, a first conductive layer formed on a second face of the first insulation layer, and an interlayer conductive portion penetrating the first insulation layer to be connected to the first conductive layer and protruding from a first face of the first insulation layer; an electric component connected to the interlayer conductive portion; and a second board including a second insulation layer having an opening portion incorporating the electric component, and a second conductive layer formed on at least either one of a first face and a second face of the second insulation layer. The second conductive layer includes a frame portion. The opening portion is formed so as to penetrate the second insulation layer in a thickness direction thereof over the entirety of the inner region of the frame portion.

Abstract translation: 提供了一种部件嵌入式板，其包括：第一板，包括第一绝缘层，形成在第一绝缘层的第二面上的第一导电层和穿过第一绝缘层的层间导电部分，以连接到第一绝缘层 导电层，并从第一绝缘层的第一面突出; 连接到所述层间导电部的电气部件; 以及第二基板，包括具有结合有电气部件的开口部的第二绝缘层，以及形成在第二绝缘层的第一面和第二面的至少任一个上的第二导电层。 第二导电层包括框架部分。 开口部形成为在其整体的框部的内部区域的厚度方向上贯通第二绝缘层。

公开(公告)号：US20130118791A1

公开(公告)日：2013-05-16

申请号：US13734474

申请日：2013-01-04

Applicant: FUJIKURA LTD.

Inventor： Masahiro OKAMOTO

IPC: H05K1/18 ,  H05K3/32

CPC classification number: H05K1/183 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2924/15153 ,  H01L2924/19105 ,  H05K1/186 ,  H05K3/321 ,  H05K3/4623 ,  H05K2201/09481 ,  Y10T29/4913

Abstract: A laminated wiring board, includes: a first substrate in which a conductor circuit is formed on one surface of an insulating layer and an adhesive layer is formed on an other surface of the insulating layer, and conductors are formed in via holes that pass through the insulating layer and the adhesive layer so that the conductor circuit is partially exposed therefrom; an electronic component electrically connected to the conductor circuit by allowing electrodes of the electronic component to be connected to the conductors; an embedding member arranged around the electronic components so that the electronic component is embedded therein; and a second substrate having an adhesive layer laminated to face the adhesive layer of the first substrate and sandwich the electronic component and the embedding member, wherein each of the electrodes of the electronic component is continuous with the conductor circuit through two or more of the conductors.

Abstract translation: 一种叠层电路板，包括：在绝缘层的一个表面上形成导体电路并在绝缘层的另一个表面上形成粘合层的第一基板，并且在通孔中形成导体， 绝缘层和粘合剂层，使得导体电路部分地暴露于其中; 通过允许电子部件的电极连接到导体而与导体电路电连接的电子部件; 嵌入构件，其围绕电子部件布置，使得电子部件嵌入其中; 以及第二基板，其具有层压以面对第一基板的粘合剂层并夹持电子部件和嵌入部件的粘合剂层，其中电子部件的每个电极通过两个或更多个导体与导体电路连续 。