公开(公告)号：US20140183014A1

公开(公告)日：2014-07-03

申请号：US14202437

申请日：2014-03-10

Applicant: FUJITSU LIMITED

Inventor： Hiroaki INOUE ,  Xiaoyu Mi

IPC: H01H1/00 ,  H01H59/00 ,  B81B3/00

CPC classification number: H01H1/0036 ,  B81B3/0072 ,  B81B3/0097 ,  B81B2201/018 ,  B81B2203/0118 ,  H01G5/16 ,  H01H59/0009

Abstract: On seed metal layer of first metal, pedestal and counter electrode are formed of second metal by plating, adjacent to free space region. The free space region is filled with first sacrificial layer. By using resist pattern, second sacrificial metal layer is formed, extending from the first sacrificial layer to a portion of the pedestal, and lower structure of third metal is formed on the second sacrificial layer, by contiguous plating, exposing a portion of the pedestal not formed with the second sacrificial layer, the third metal having composition and thermal expansion coefficient equivalent to the second metal. Upper structure of fourth metal having composition and thermal expansion coefficient equivalent to the second and third metals is formed on the pedestal and the lower structure by plating. The first and second sacrificial layers are removed, leaving an electric equipment with a movable portion.

Abstract translation: 在第一金属的种子金属层上，基座和对电极通过电镀形成第二金属，邻近自由空间区域。 自由空间区域填充有第一牺牲层。 通过使用抗蚀剂图案，形成从第一牺牲层延伸到基座的一部分的第二牺牲金属层，并且通过连续的电镀在第二牺牲层上形成第三金属的下部结构，使基座的一部分不暴露 形成有第二牺牲层，第三金属具有与第二金属相当的组成和热膨胀系数。 具有与第二和第三金属相当的组成和热膨胀系数的第四金属的上部结构通过电镀形成在基座和下部结构上。 去除第一和第二牺牲层，留下具有可移动部分的电气设备。