OPTICAL DEVICE AND BUMP ARRANGEMENT METHOD
    1.
    发明公开

    公开(公告)号:US20230341641A1

    公开(公告)日:2023-10-26

    申请号:US18178134

    申请日:2023-03-03

    CPC classification number: G02B6/4267 G02B6/4238 G02B6/4245 G02B6/4257

    Abstract: An optical device includes a substrate that includes a substrate-side electrode, and a chip that includes N active layers and a chip-side electrode that is mounted on the substrate-side electrode. From among bumps that are disposed side by side with an Nth layer on both sides of a surface that is located opposite the Nth layer and that is included in the substrate-side electrode, bumps located at a position farther away from the center of gravity of all of the bumps are defined as first bumps, and bumps located at a position closer to the center of gravity are defined as second bumps. In at least one combination of the first bump and the second bump, the first bump and the second bump are arranged on the substrate-side electrode such that a distance between the first bump and the surface is longer than a distance between the second bump and the surface.

    OPTICAL INTEGRATED DEVICE, OPTICAL INTEGRATED CIRCUIT WAFER, AND METHOD OF MANUFACTURING THE OPTICAL INTEGRATED DEVICE

    公开(公告)号:US20230084190A1

    公开(公告)日:2023-03-16

    申请号:US17884895

    申请日:2022-08-10

    Abstract: An optical integrated device includes a substrate and a waveguide that has a hollow structure. The waveguide includes a first waveguide and a second waveguide that is optically coupled to the first waveguide and that has a smaller relative refractive index difference than that of the first waveguide and converts a mode diameter to a mode diameter of an optical fiber in accordance with travelling of light. The optical integrated device includes a dent portion that is formed in the vicinity of the dicing line on the substrate such that the width of the output end surface is smaller than the core width of the optical fiber that is optically coupled to the output end surface in the state in which the dicing end surface of the substrate protrudes farther than the output end surface of the second waveguide in the axial direction of the optical waveguide.

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