公开(公告)号：US10394291B2

公开(公告)日：2019-08-27

申请号：US15825703

申请日：2017-11-29

Applicant: Facebook, Inc.

Inventor： Chuankeat Kho ,  John Edward Fernandes ,  Yueming Li

IPC: G06F1/20 ,  H05K1/11 ,  H05K1/18 ,  H05K7/20 ,  H05K7/14 ,  H05K1/02 ,  G06F1/18 ,  H05K1/14

Abstract: An interface adapter may include a printed circuit board that includes an edge connector dimensioned to be inserted into an expansion socket of a computing device. The interface adapter may also include a plurality of modular computing components removably mounted to a top surface of the printed circuit board, where each modular computing component includes a connector dimensioned to be inserted into a socket of the printed circuit board and the connector of each modular computing component includes a pinout that is more compact than a pinout of the edge connector of the printed circuit board. In addition, the interface adapter may include one or more modular heatsinks coupled to a top surface of each modular computing component to facilitate heat dissipation from the top surface of the modular computing component. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US20190163245A1

公开(公告)日：2019-05-30

申请号：US15825703

申请日：2017-11-29

Applicant: Facebook, Inc.

Inventor： Chuankeat Kho ,  John Edward Fernandes ,  Yueming Li

IPC: G06F1/20 ,  H05K1/11 ,  H05K1/18 ,  H05K7/20 ,  H05K7/14 ,  H05K1/02 ,  G06F1/18

CPC classification number: G06F1/20 ,  G06F1/185 ,  H05K1/0206 ,  H05K1/117 ,  H05K1/144 ,  H05K1/181 ,  H05K7/1402 ,  H05K7/1409 ,  H05K7/20409 ,  H05K7/20509 ,  H05K2201/042 ,  H05K2201/066

Abstract: An interface adapter may include a printed circuit board that includes an edge connector dimensioned to be inserted into an expansion socket of a computing device. The interface adapter may also include a plurality of modular computing components removably mounted to a top surface of the printed circuit board, where each modular computing component includes a connector dimensioned to be inserted into a socket of the printed circuit board and the connector of each modular computing component includes a pinout that is more compact than a pinout of the edge connector of the printed circuit board. In addition, the interface adapter may include one or more modular heatsinks coupled to a top surface of each modular computing component to facilitate heat dissipation from the top surface of the modular computing component. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US10234913B1

公开(公告)日：2019-03-19

申请号：US15825717

申请日：2017-11-29

Applicant: Facebook, Inc.

Inventor： Chuankeat Kho ,  John Edward Fernandes ,  Yueming Li

IPC: G06F1/18 ,  H05K1/14 ,  H05K3/36 ,  H01R12/70 ,  H01R12/73

Abstract: An expansion card latching mechanism may include a base anchored to a printed circuit board. The latching mechanism may also include a latch coupled to the base such that a proximal end of the latch locks a proximal end of an expansion card to a fixed position on the printed circuit board. In addition the latching mechanism may include a compression spring wrapped around an arm of the latch such that the compression spring exerts a tension to maintain a locked position of the latch. Various other apparatuses, systems, and methods are also disclosed.