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1.发明申请METHOD AND APPARATUS PROVIDING ELECTRICAL CONNECTION TO A PHOTOVOLTAIC MODULE 审中-公开向光伏模块提供电气连接的方法和装置公开(公告)号：US20130118544A1
公开(公告)日：2013-05-16
申请号：US13675372
申请日：2012-11-13
Applicant: First Solar, Inc.
Inventor： Richard Malik
CPC classification number: H01L31/02008 , H01L31/02013 , H01L31/048 , H02S40/34 , Y02E10/50
Abstract: Disclosed embodiments include photovoltaic modules having a conductor interface and a heat-activated adhesive layer configured to bond the conductor interface to the module. Methods of manufacturing photovoltaic modules having a conductor interface and heat-activated adhesive layer are also disclosed.
Abstract translation: 所公开的实施例包括具有导体接口和被配置为将导体接口连接到模块的热活化粘合剂层的光伏模块。 还公开了具有导体界面和热活化粘合剂层的光伏模块的制造方法。
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