公开(公告)号：US20180132348A1

公开(公告)日：2018-05-10

申请号：US15803527

申请日：2017-11-03

Applicant: Flex Ltd.

Inventor： JH Berkel ,  Todd Robinson ,  Joan K. Vrtis

IPC: H05K1/02 ,  H05K3/02 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H05K1/021 ,  H05K3/0061 ,  H05K3/022 ,  H05K3/4611 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/10416

Abstract: A metal pallet is integrated within a circuit board using a process similar to a multilayer PCB, which integrates the metal pallet into the circuit board at the same time as the supporting layers are fabricated. The use of B-stage material provides a bonding mechanism for the metal pallet to be embedded within the circuit board, creating a cohesive integrated part. Embedding the pallet during the fabrication process, pre-lamination, generates a more robust construction and connection not impacted by post fabrication process in assembly. After assembly the circuit board with embedded metal pallet can be mounted directly on a heat sink, cool ribbon or other feature required to help remove heat. The planar back side surface provides a more robust mounting of the metal pallet than a post fabricated assembly as used in conventional techniques.