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1.发明公开公开(公告)号：US20240134136A1
公开(公告)日：2024-04-25
申请号：US18493097
申请日：2023-10-23
Applicant: Formerica Optoelectronics, Inc.
Inventor： Yun-Cheng HUANG , Yi-Nan SHIH , Chih-Chung LIN , Yun-Chin TSAI
CPC classification number: G02B6/4271 , G02B6/4246 , G02B6/428 , H05K1/0203 , H05K2201/10151 , H05K2201/10219
Abstract: An optical transceiver module temperature control device includes a processor, a printed circuit board assembly, an optical transceiver module and a temperature adjustment element. The processor is configured to measure an ambient temperature. The printed circuit board assembly includes a first side and a second side. The first side is opposite to the second side. The optical transceiver module is disposed on the first side of the printed circuit board assembly. The temperature adjustment element is coupled to the processor and disposed on the second side of the printed circuit board assembly. The processor is configured to generate a temperature adjustment signal according to the ambient temperature and an operating temperature range. The temperature adjustment element is configured to perform heat exchange with the printed circuit board assembly according to the temperature adjustment signal to adjust a temperature of the optical transceiver module into the operating temperature range.
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2.发明公开公开(公告)号：US20240231023A9
公开(公告)日：2024-07-11
申请号：US18493097
申请日：2023-10-24
Applicant: Formerica Optoelectronics, Inc.
Inventor： Yun-Cheng HUANG , Yi-Nan SHIH , Chih-Chung LIN , Yun-Chin TSAI
CPC classification number: G02B6/4271 , G02B6/4246 , G02B6/428 , H05K1/0203 , H05K2201/10151 , H05K2201/10219
Abstract: An optical transceiver module temperature control device includes a processor, a printed circuit board assembly, an optical transceiver module and a temperature adjustment element. The processor is configured to measure an ambient temperature. The printed circuit board assembly includes a first side and a second side. The first side is opposite to the second side. The optical transceiver module is disposed on the first side of the printed circuit board assembly. The temperature adjustment element is coupled to the processor and disposed on the second side of the printed circuit board assembly. The processor is configured to generate a temperature adjustment signal according to the ambient temperature and an operating temperature range. The temperature adjustment element is configured to perform heat exchange with the printed circuit board assembly according to the temperature adjustment signal to adjust a temperature of the optical transceiver module into the operating temperature range.
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