公开(公告)号：US11945155B2

公开(公告)日：2024-04-02

申请号：US17479271

申请日：2021-09-20

Applicant: Formlabs, Inc.

Inventor： Aruni Kacker ,  Andrew DeGonge ,  Garth Whelan

IPC: B33Y50/02 ,  B29C64/124 ,  B29C64/393 ,  B33Y10/00 ,  B29C64/282

CPC classification number: B29C64/124 ,  B29C64/393 ,  B33Y10/00 ,  B33Y50/02 ,  B29C64/282

Abstract: In additive fabrication, less stiff layers generally require a comparatively higher peel force during separation, and that therefore geometric structures that include less stiff layers will also require a comparatively higher peel force during separation. Techniques to lower or otherwise mitigate undesirably large peel forces are described. These techniques include modification to how layers susceptible to a large peel force are formed, modification to a model of a part prior to generating instructions for an additive fabrication device to fabricate the part, and/or improvements to an additive fabrication device hardware.

公开(公告)号：US20220088852A1

公开(公告)日：2022-03-24

申请号：US17479271

申请日：2021-09-20

Applicant: Formlabs, Inc.

Inventor： Aruni Kacker ,  Andrew DeGonge ,  Garth Whelan

IPC: B29C64/124 ,  B29C64/393 ,  B33Y10/00 ,  B33Y50/02

Abstract: In additive fabrication, less stiff layers generally require a comparatively higher peel force during separation, and that therefore geometric structures that include less stiff layers will also require a comparatively higher peel force during separation. Techniques to lower or otherwise mitigate undesirably large peel forces are described. These techniques include modification to how layers susceptible to a large peel force are formed, modification to a model of a part prior to generating instructions for an additive fabrication device to fabricate the part, and/or improvements to an additive fabrication device hardware.