公开(公告)号：US20230182390A1

公开(公告)日：2023-06-15

申请号：US18062627

申请日：2022-12-07

Applicant: Formlabs Inc.

Inventor： Dmitri Megretski ,  Benjamin FrantzDale ,  Jacob Sanchez ,  Alec Rudd

IPC: B29C64/30 ,  B29C64/264 ,  B33Y40/00

CPC classification number: B29C64/30 ,  B29C64/264 ,  B33Y40/00 ,  B33Y10/00

Abstract: A method includes curing a photopolymer resin disposed between a first build surface and a flexible film layer to form a print layer of a printed part. Here, the print layer of the printed part defines a second build surface attached to the flexible film layer. The method also includes translating a peeling mechanism between the second build surface and the flexible film layer to detach the flexible film layer from the second build surface.

公开(公告)号：US12233600B2

公开(公告)日：2025-02-25

申请号：US18062627

申请日：2022-12-07

Applicant: Formlabs Inc.

Inventor： Dmitri Megretski ,  Benjamin FrantzDale ,  Jacob Sanchez ,  Alec Rudd

IPC: B29C64/30 ,  B29C64/264 ,  B33Y40/00 ,  B29C64/124 ,  B29C64/188 ,  B29C64/223 ,  B29C64/245 ,  B33Y10/00 ,  B33Y30/00

Abstract: A method includes curing a photopolymer resin disposed between a first build surface and a flexible film layer to form a print layer of a printed part. Here, the print layer of the printed part defines a second build surface attached to the flexible film layer. The method also includes translating a peeling mechanism between the second build surface and the flexible film layer to detach the flexible film layer from the second build surface.