公开(公告)号：US20230211559A1

公开(公告)日：2023-07-06

申请号：US18150533

申请日：2023-01-05

Applicant: Formlabs Inc.

Inventor： Seth P. Berg ,  Suhyun Oh ,  Eric Wong ,  Samuel k. Porter ,  Nathan Jackel ,  Julian A. Petrillo ,  Mike Morin ,  Sharon Soong ,  Douglas Ivanoff

IPC: B29C64/379 ,  B33Y40/00

CPC classification number: B29C64/379 ,  B33Y40/00

Abstract: A post-processing device configured to be coupled to a three-dimensional printer. The post-processing device includes a head assembly that includes a release device and a collection device. A rail extends in a first direction, and the head assembly is configured to travel along the rail. The device also includes a pedestal assembly configured to be coupled to a base of the three-dimensional printer, and an opening device for opening a cover of the three-dimensional printer. At a parts collection location on the rail, the release device of the head assembly is configured to engage with a build platform of the three-dimensional printer to release printed parts on the build platform, and the collection device of the head assembly is below the build platform and is configured to collect the released printed parts.