公开(公告)号：US20040018348A1

公开(公告)日：2004-01-29

申请号：US10334103

申请日：2002-12-31

Applicant: Fuji Electric Co., Ltd.

Inventor： Shigemasa Saito

IPC: B32B003/00

CPC classification number: H05K3/285 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2203/122 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A fire retardant multilayered printed wiring board without halogen compounds, having enhanced thermal conductivity of insulator layers to prevent electronic components from being damaged during soldering. The insulator layers are formed of a glass cloth impregnated with an epoxy resin composition. Metal foil layers, in each of which a circuit is formed, are laminated alternately with the insulator layers. The epoxy resin composition includes at least phosphate ester, aluminum hydroxide, silica, calcium oxide, strontium titanate, and iron oxide. Inorganic components are provided in the insulator layers as about 8% to about 18% by mass of P2O5, about 20% to about 28% by mass of Al2O3, about 0.1% to about 0.6% by mass of SiO2, about 0.1% to about 1.0% by mass of Cl, about 15% to about 20% by mass of CaO, about 0.3% to about 0.5% by mass of TiO2, about 0.2% to about 0.4% by mass of Fe2O3, and about 0.1% to about 0.3% by mass of SrO, in converted values as measured by an X-ray fluorescence analysis.

Abstract translation: 一种不含卤素化合物的阻燃多层印刷电路板，具有增强的绝缘体层的导热性，以防止电子元件在焊接过程中受损。 绝缘体层由浸渍有环氧树脂组合物的玻璃布形成。 在其中形成电路的金属箔层与绝缘体层交替层叠。 环氧树脂组合物至少包含磷酸酯，氢氧化铝，二氧化硅，氧化钙，钛酸锶和氧化铁。 无机组分在绝缘体层中提供为约8％至约18质量％的P2O5，约20％至约28质量％的Al2O3，约0.1％至约0.6质量％的SiO 2，约0.1％至约 0.1质量％的Cl，约15质量％至约20质量％的CaO，约0.3％至约0.5质量％的TiO 2，约0.2％至约0.4质量％的Fe 2 O 3，以及约0.1％至约0.3 通过X射线荧光分析测定的转化值中的SrO的质量％。