公开(公告)号：US09761552B2

公开(公告)日：2017-09-12

申请号：US15271744

申请日：2016-09-21

Applicant: FUJITSU LIMITED

Inventor： Kozo Shimizu ,  Seiki Sakuyama

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L25/00 ,  B23K1/00 ,  B23K3/08 ,  H01L23/31 ,  H01L23/488 ,  H01L23/498 ,  B23K35/02 ,  B23K35/26 ,  H05K1/02 ,  H05K3/34 ,  H01L23/14 ,  B23K101/40 ,  B23K101/42 ,  H05K1/09 ,  H05K1/11

CPC classification number: H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

公开(公告)号：US09412715B2

公开(公告)日：2016-08-09

申请号：US14508736

申请日：2014-10-07

Applicant: FUJITSU LIMITED

Inventor： Kozo Shimizu ,  Seiki Sakuyama ,  Toshiya Akamatsu

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/50 ,  H01L25/065 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L24/81 ,  H01L21/50 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L23/5383 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/16506 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81002 ,  H01L2224/81065 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/8142 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81457 ,  H01L2224/81464 ,  H01L2224/81469 ,  H01L2224/81805 ,  H01L2224/81893 ,  H01L2224/81931 ,  H01L2224/83815 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01083

Abstract: A semiconductor device, includes: a connection member including a first pad formed on a principal surface thereof; a semiconductor chip including a circuit-formed surface on which a second pad is formed, the chip mounted on the connection member so that the circuit-formed surface faces the principal surface; and a solder bump that connects the first and second pads and is made of metal containing Bi and Sn, wherein the bump includes a first interface-layer formed adjacent to the second pad, a second interface-layer formed adjacent to the first pad, a first intermediate region formed adjacent to either one of the interface-layers, and a second intermediate region formed adjacent to the other one of the interface-layers and formed adjacent to the first intermediate region; Bi-concentration in the first intermediate region is higher than a Sn-concentration; and a Sn-concentration in the second intermediate region is higher than a Bi-concentration.

Abstract translation: 一种半导体器件，包括：连接构件，包括形成在其主表面上的第一焊盘; 半导体芯片，其包括形成有第二焊盘的电路形成表面，所述芯片安装在所述连接构件上，使得所述电路形成表面面向所述主表面; 以及焊料凸块，其连接所述第一和第二焊盘，并且由含有Bi和Sn的金属制成，其中所述凸块包括邻近所述第二焊盘形成的第一界面层，邻近所述第一焊盘形成的第二界面层， 形成在与所述界面层中的任一个邻接的第一中间区域和与所述界面层中的另一个相邻地形成并与所述第一中间区域相邻形成的第二中间区域; 第一中间区域的双浓度高于Sn-浓度; 并且第二中间区域中的Sn浓度高于Bi浓度。

公开(公告)号：US10167537B2

公开(公告)日：2019-01-01

申请号：US14960638

申请日：2015-12-07

Applicant: FUJITSU LIMITED

Inventor： Taiki Uemura ,  Kozo Shimizu ,  Seiki Sakuyama

IPC: H05K7/00 ,  C22C28/00 ,  B23K35/26 ,  C22C13/00 ,  B23K35/30 ,  B23K35/40 ,  H01L23/00 ,  H05K3/34

Abstract: An electronic apparatus includes: a first electronic component including a first electrode; solder on the first electrode; and a phase containing In, Ag, and Cu, the phase being dispersed and included in the solder.And a method for manufacturing an electronic apparatus, the method includes: forming solder on a first electrode of a first component, the solder including a phase containing In, Ag, and Cu, the phase being dispersed in the solder.

公开(公告)号：US09620470B2

公开(公告)日：2017-04-11

申请号：US15050558

申请日：2016-02-23

Applicant: FUJITSU LIMITED

Inventor： Kozo Shimizu ,  Seiki Sakuyama ,  Toyoo Miyajima

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/768 ,  H05K3/34 ,  B23K35/24 ,  B23K35/26 ,  B23K35/00 ,  B23K35/02 ,  H05K3/24 ,  B23K101/40

CPC classification number: H01L24/13 ,  B23K35/004 ,  B23K35/007 ,  B23K35/0244 ,  B23K35/24 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  H01L21/76843 ,  H01L23/49811 ,  H01L23/49866 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05582 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16501 ,  H01L2224/73204 ,  H01L2224/81075 ,  H01L2224/81211 ,  H01L2224/81815 ,  H01L2924/0103 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/0105 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01024 ,  H01L2924/01032 ,  H01L2924/00

Abstract: A method of manufacturing a semiconductor device includes forming a barrier metal film on a surface of at least one of a first electrode of a wiring board and a second electrode of a semiconductor element, providing a connection terminal between the first and second electrodes, the connection terminal being made of solder containing tin, bismuth and zinc, and bonding the connection terminal to the barrier metal film by heating the connection terminal and maintaining the temperature of the connection terminal at a constant temperature not lower than a melting point of the solder for a certain period of time.

公开(公告)号：US09530745B2

公开(公告)日：2016-12-27

申请号：US15142690

申请日：2016-04-29

Applicant: FUJITSU LIMITED

Inventor： Kozo Shimizu ,  Seiki Sakuyama

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L25/00 ,  B23K1/00 ,  B23K3/08 ,  H01L23/488 ,  H01L23/498 ,  H01L23/31 ,  H05K1/02 ,  H05K3/34 ,  H01L23/14

CPC classification number: H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

公开(公告)号：US09490232B2

公开(公告)日：2016-11-08

申请号：US14532032

申请日：2014-11-04

Applicant: FUJITSU LIMITED

Inventor： Kozo Shimizu ,  Seiki Sakuyama

IPC: H01L25/065 ,  H01L23/367 ,  H01L23/00 ,  H01L25/00 ,  B23K1/00 ,  B23K3/08 ,  H01L23/488 ,  H01L23/498 ,  H01L23/31 ,  H05K1/02 ,  H05K3/34 ,  H01L23/14

CPC classification number: H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

Abstract translation: 电子设备包括具有第一端子的第一电子部件，与第一端子相对的第二端子的第二电子部件和与第一端子和第二端子连接的接合部。 接合部分包含在第一端子和第二端子彼此相对的方向上延伸的极性化合物。 接合部分包含杆状化合物，从而提高接合部分的强度。 当第一端子和第二端子接合时，第一电子部件和第二电子部件之一的温度被制成高于另一端子的温度。 在该状态下将接合材料冷却并固化。 通过这样做，形成极点状化合物。

公开(公告)号：US20150162312A1

公开(公告)日：2015-06-11

申请号：US14532032

申请日：2014-11-04

Applicant: FUJITSU LIMITED

Inventor： Kozo Shimizu ,  Seiki Sakuyama

IPC: H01L25/065 ,  B23K3/08 ,  H01L25/00 ,  B23K1/00 ,  H01L23/367 ,  H01L23/00

CPC classification number: H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

Abstract translation: 电子设备包括具有第一端子的第一电子部件，与第一端子相对的第二端子的第二电子部件和与第一端子和第二端子连接的接合部。 接合部分包含在第一端子和第二端子彼此相对的方向上延伸的极性化合物。 接合部分包含杆状化合物，从而提高接合部分的强度。 当第一端子和第二端子接合时，第一电子部件和第二电子部件之一的温度被制成高于另一端子的温度。 在该状态下将接合材料冷却并固化。 通过这样做，形成极点状化合物。

公开(公告)号：US08901751B2

公开(公告)日：2014-12-02

申请号：US13632268

申请日：2012-10-01

Applicant: Fujitsu Limited

Inventor： Kozo Shimizu ,  Seiki Sakuyama ,  Toshiya Akamatsu

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L21/50 ,  H01L23/538 ,  H01L23/31

CPC classification number: H01L24/81 ,  H01L21/50 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L23/5383 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/16506 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81002 ,  H01L2224/81065 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/8142 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81457 ,  H01L2224/81464 ,  H01L2224/81469 ,  H01L2224/81805 ,  H01L2224/81893 ,  H01L2224/81931 ,  H01L2224/83815 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01083

Abstract: A semiconductor device, includes: a connection member including a first pad formed on a principal surface thereof; a semiconductor chip including a circuit-formed surface on which a second pad is formed, the chip mounted on the connection member so that the circuit-formed surface faces the principal surface; and a solder bump that connects the first and second pads and is made of metal containing Bi and Sn, wherein the bump includes a first interface-layer formed adjacent to the second pad, a second interface-layer formed adjacent to the first pad, a first intermediate region formed adjacent to either one of the interface-layers, and a second intermediate region formed adjacent to the other one of the interface-layers and formed adjacent to the first intermediate region; Bi-concentration in the first intermediate region is higher than a Sn-concentration; and a Sn-concentration in the second intermediate region is higher than a Bi-concentration.

Abstract translation: 一种半导体器件，包括：连接构件，包括形成在其主表面上的第一焊盘; 半导体芯片，其包括形成有第二焊盘的电路形成表面，所述芯片安装在所述连接构件上，使得所述电路形成表面面向所述主表面; 以及焊料凸块，其连接所述第一和第二焊盘，并且由含有Bi和Sn的金属制成，其中所述凸块包括邻近所述第二焊盘形成的第一界面层，邻近所述第一焊盘形成的第二界面层， 形成在与所述界面层中的任一个相邻的第一中间区域和与所述界面层中的另一个相邻地形成并与所述第一中间区域相邻形成的第二中间区域; 第一中间区域的双浓度高于Sn-浓度; 并且第二中间区域中的Sn浓度高于Bi浓度。

公开(公告)号：US12244353B2

公开(公告)日：2025-03-04

申请号：US18165676

申请日：2023-02-07

Applicant: Fujitsu Limited

Inventor： Kozo Shimizu ,  Hisakatsu Yamaguchi

IPC: H04B10/80 ,  H04B10/50

Abstract: An optical module switch device includes a first serial-parallel-converter coupled to first signal-lines coupled to optical modules, and second signal-lines, a number of the second signal-lines being greater than the first signal-lines thereof, and configured to transmit/receive first signals at a first transmission-rate to/from the optical modules by using the first signal-lines, respectively, a second serial-parallel-converter coupled to second signal-lines coupled to the first serial-parallel-converter, and third signal-lines, a number of the third lines being greater than the second signal-lines thereof, and configured to transmit/receive second signals at a second transmission-rate lower than the first transmission-rate to/from the first serial-parallel-converter by using the second signal-lines, respectively, and a switch circuit coupled to the third signal-lines, and configured to transmit/receive third signals at a third transmission-rate lower than the second transmission-rate to/from the second serial-parallel-converter by using the third signal-lines, respectively, to perform routing processing based on the received third signals.

公开(公告)号：US09812418B2

公开(公告)日：2017-11-07

申请号：US15351992

申请日：2016-11-15

Applicant: Fujitsu Limited

Inventor： Kozo Shimizu ,  Seiki Sakuyama

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L25/00 ,  B23K1/00 ,  B23K3/08 ,  H01L23/31 ,  H01L23/488 ,  H01L23/498 ,  B23K35/02 ,  B23K35/26 ,  H05K1/02 ,  H05K3/34 ,  H01L23/14 ,  B23K101/40 ,  B23K101/42 ,  H05K1/09 ,  H05K1/11

CPC classification number: H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.