公开(公告)号：US20030173109A1

公开(公告)日：2003-09-18

申请号：US10345351

申请日：2003-01-16

Applicant: Fujitsu Limited

Inventor： Mitsuo Suehiro

IPC: H05K001/03

CPC classification number: H01L24/81 ,  H01L24/98 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13021 ,  H01L2224/16237 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K3/281 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/2036 ,  H05K2203/0182 ,  H05K2203/0191 ,  H05K2203/0264 ,  H05K2203/176 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49147 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A printed circuit board unit comprises an insulated film disposed between a printed circuit board and an electronic component so as to define a through hole for receiving the solder bump. The through hole may be designed to form a constriction in the solder bump. Electric connection can reliably be established between the printed circuit board and the electronic component since the solder bump is allowed to penetrate through the through hole in the insulated film. When the insulated film is brought away from the printed circuit board, the insulated film serves to tear the solder bump in two pieces at the constriction, so that the electronic component can easily be detached from the printed circuit board.

Abstract translation: 印刷电路板单元包括布置在印刷电路板和电子部件之间的绝缘膜，以便限定用于接收焊料凸块的通孔。 通孔可以设计成在焊料凸块中形成收缩。 由于允许焊料凸块穿过绝缘膜中的通孔，所以能够可靠地在印刷电路板和电子部件之间建立电连接。 当绝缘膜离开印刷电路板时，绝缘膜用于在缩小时将焊料凸块撕成两片，使得电子部件可以容易地从印刷电路板上拆下。

公开(公告)号：US20030051905A1

公开(公告)日：2003-03-20

申请号：US10073106

申请日：2002-02-12

Applicant: Fujitsu Limited

Inventor： Tsuyoshi Yamamoto ,  Mitsuo Suehiro ,  Hiroshi Yamada

IPC: H05K003/34

CPC classification number: H05K3/305 ,  H01L2224/29035 ,  H01L2224/29036 ,  H01L2224/73103 ,  H01L2224/73204 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/0129 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0182 ,  H05K2203/0475 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49169 ,  H01L2924/00012

Abstract: When an electronic component is mounted on a substrate, the electronic component is first placed on the substrate with a solid support interposed between the electronic component and the substrate. The solid support serves to space a terminal conductor of the electronic component from a corresponding terminal pad on the substrate. A conductive bonding material is then melted on the terminal pad. The melted conductive bonding material gets exposed to the peripheral atmosphere over a larger area. Even if a bubble is generated within the melted conductive bonding material, the bubble is allowed to easily get out of the melted conductive bonding material. Removal of the gas is promoted in the melted conductive bonding material. The solid support is subsequently melted. The electronic component is moved down toward the substrate, thereby contacting the terminal conductor with the melted conductive bonding material on the corresponding terminal pad. Removal of the gas in this manner leads to improvement in the strength of bonding between the substrate and the electronic component.

Abstract translation: 当将电子部件安装在基板上时，首先将电子部件放置在基板上，并将固体支撑体插入在电子部件和基板之间。 固体支撑件用于将电子部件的端子导体从衬底上的对应的端子焊盘放置。 导电接合材料然后在端子焊盘上熔化。 熔融的导电接合材料在较大的面积上暴露于周围的气氛。 即使在熔融的导电接合材料内产生气泡，也允许气泡容易地从熔融的导电接合材料中脱出。 在熔融的导电接合材料中促进除去气体。 固体支持物随后熔化。 电子部件朝向基板移动，从而使端子导体与相应的端子焊盘上的熔融的导电接合材料接触。 以这种方式去除气体导致基板和电子部件之间的结合强度的改善。