公开(公告)号：US20170212402A1

公开(公告)日：2017-07-27

申请号：US15384854

申请日：2016-12-20

Applicant: Fujitsu Optical Components Limited

Inventor： Akira ISHII ,  Shinji MARUYAMA ,  Yuki SAKURAI ,  Masaharu DOI ,  Osamu OYAMA ,  Masami KAMIOKA

IPC: G02F1/225 ,  H01R12/59 ,  G02B6/126 ,  H01R9/05 ,  H01R24/38 ,  H01R12/79 ,  H01R12/51

CPC classification number: G02F1/2255 ,  G02B6/126 ,  G02F2201/12 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01R9/0515 ,  H01R12/515 ,  H01R12/592 ,  H01R12/7076 ,  H01R12/79 ,  H01R24/38 ,  H01R24/50 ,  H01L2924/00014

Abstract: An optical module includes a driver that generates an electric signal and an optical modulator that has a notch in which at least a portion of the driver is accommodated and performs optical modulation using an electric signal generated by the driver. The optical module also includes a first connector electrically connected to the driver in the notch of the optical modulator. The optical module further includes a second connector provided on a surface of the notch of the optical modulator, the surface being opposed to the first connector. The second connector is electrically connected to the optical modulator. Furthermore, the optical module includes a coaxial pin that is connected to the first connector and the second connector and transmits the electric signal generated by the driver to the optical modulator.

公开(公告)号：US20220104388A1

公开(公告)日：2022-03-31

申请号：US17481492

申请日：2021-09-22

Applicant: FUJITSU OPTICAL COMPONENTS LIMITED

Inventor： Kazuya SASAKI ,  Takatoshi YAGISAWA ,  Tsutomu OHTSU ,  Masami KAMIOKA

IPC: H05K7/20 ,  H05K7/14

Abstract: An optical communication module includes: a circuit board; optical communication devices that are provided on an upper surface side of the circuit board; a case that accommodates the circuit board and the optical communication devices; and a heatsink that is attached to the case. The optical communication devices include a first device and a second device. The first device is located closer to an inlet opening for cooling air for cooling the heatsink than the second device is. A height from the circuit board to a top of the first device is greater than a height from the circuit board to a top of the second device. The heatsink is not equipped with a cooling fin in a first region where the first device is provided, and the heatsink is equipped with a cooling fin in a second region where the second device is provided.