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公开(公告)号：US20210278614A1
公开(公告)日：2021-09-09
申请号：US17132918
申请日：2020-12-23
Applicant: Fujitsu Optical Components Limited
Inventor： TERUHIRO KUBO , YUKA OJIMA , Tetsuo Ishizaka , Tomoyuki Ito
Abstract: An optical module includes: a board that is accommodated in a housing and in which a through hole is formed; a metal plate that is bonded to an area of the board including the through hole; a component that is mounted on one surface of the metal plate and is arranged inside the through hole; and a thermal-conductive member that is arranged on another surface of the metal plate and transmits heat generated by the component to the housing.
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