METHODS AND SYSTEMS FOR AN INVASIVE DEPLOYABLE DEVICE

    公开(公告)号:US20220313206A1

    公开(公告)日:2022-10-06

    申请号:US17222387

    申请日:2021-04-05

    Abstract: A deployable invasive device includes a transducer with a plurality of elements with linked by at least one shape memory material, the at least one shape memory material configured to move the plurality of the elements relative to one another between a first configuration and a second configuration in response to the thermal stimulus. The shape memory material comprises at least one active region configured to change shape to facilitate transition between the first configuration and the second configuration. The deployable invasive device further includes at least one integral heating resistor on or within the at least one active region and configured to heat the shape memory material surrounding the integral heating resistor to provide the thermal stimulus.

    METHODS AND SYSTEMS FOR AN ELECTRO-ACOUSTIC TRANSDUCER

    公开(公告)号:US20250010335A1

    公开(公告)日:2025-01-09

    申请号:US18349054

    申请日:2023-07-07

    Abstract: Various methods and systems are provided for an electroacoustic module (EAM) for a probe. In one example, the EAM may be formed of a microelectromechanical systems (MEMS) wafer bonded to a complementary metal-oxide semiconductor (CMOS) wafer and having a front side formed of a surface of the MEMS wafer. The surface of the MEMS wafer may include an active area of capacitive micromachined ultrasound transducer (CMUT) cells and input/output (I/O) regions of output contacts arranged adjacent to the active area.

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