公开(公告)号：US20140252541A1

公开(公告)日：2014-09-11

申请号：US13792293

申请日：2013-03-11

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Ivan Dimitrov Nanov ,  John Frank Steel

IPC: H01L23/34 ,  H05K3/32

CPC classification number: H05K3/32 ,  H01L23/36 ,  H01L23/49555 ,  H01L2924/0002 ,  H05K1/181 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/00

Abstract: A power train assembly is provided. The power train assembly includes a component package including a first transistor having a first gate, a first drain, and a first source, a second transistor having a second gate, a second drain, and a second source, and a thermal pad configured to dissipate heat generated in the component package, wherein the thermal pad is electrically coupled to the first source and the second drain. The power train assembly further includes a printed circuit board (PCB) electrically coupled to the component package, and an electrical component electrically coupled directly to the thermal pad, wherein the electrical component is external to the component package.

Abstract translation: 提供动力总成组件。 动力传动系组件包括部件封装，其包括具有第一栅极，第一漏极和第一源极的第一晶体管，具有第二栅极，第二漏极和第二源极的第二晶体管，以及散热板 在组件封装中产生的热量，其中散热垫电耦合到第一源极和第二漏极。 动力传动系组件还包括电耦合到部件封装的印刷电路板（PCB），以及直接耦合到散热焊盘的电气部件，其中电组件在组件封装外部。