公开(公告)号：US20220210918A1

公开(公告)日：2022-06-30

申请号：US17562614

申请日：2021-12-27

Applicant: GIO Optoelectronics Corp.

Inventor： Chin-Tang LI

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/11

Abstract: An electronic device includes a supporting board, an electrical board and electronic units. The supporting board includes a circuit layer. The electrical board has a board body, through holes through the board body, an electrical layer on the board body, and primary conductive elements respectively in the through holes. The board body has opposite first and second surfaces. The through holes communicate with the first surface and the second surface. The primary conductive elements electrically connect the electrical layer to the circuit layer. The electronic units are arranged on the first surface. Each electronic unit partially overlaps with one corresponding through hole in a projection direction of the electrical board. Each electronic unit has an electronic component and a secondary conductive element electrically connecting the electronic component to the electrical layer. The secondary conductive elements and the primary conductive elements are arranged in dislocation in the projection direction.

公开(公告)号：US20190198490A1

公开(公告)日：2019-06-27

申请号：US16220610

申请日：2018-12-14

Applicant: GIO Optoelectronics Corp

Inventor： Chin-Tang LI

IPC: H01L25/18 ,  H01L23/31 ,  H01L27/12 ,  H01L25/00

Abstract: An electronic package unit, a manufacturing method thereof and an electronic device are disclosed. The manufacturing method includes: providing an insulation substrate, wherein the insulation substrate has a first surface and a second surface opposite to the first surface; forming a plurality of sub-matrix circuits on the insulation substrate, wherein each sub-matrix circuit comprises at least one thin film transistor; disposing at least one functional chip on the first surface, wherein the functional chip is electrically connected with the sub-matrix circuit; forming a plurality of through-holes on the insulation substrate and disposing a conductive material in the through-holes, so that the functional chip is electrically connected to the second surface through the sub-matrix circuits and the conductive material; forming a protection layer on the first surface to cover the functional chips; and cutting the insulation substrate and the protection layer to form a plurality of electronic package units.

公开(公告)号：US20210175381A1

公开(公告)日：2021-06-10

申请号：US17067368

申请日：2020-10-09

Applicant: GIO Optoelectronics Corp.

Inventor： Chin-Tang LI

IPC: H01L31/0392 ,  H01L31/0224

Abstract: An electronic device comprises plural first substrates, plural photoelectric structures, a third substrate, plural driving units, plural conductive layers and plural first conductive structures. The first substrates are arranged in coplanar in a first direction. The photoelectric structures are arranged in coplanar in the first direction and disposed on the first substrate. Each photoelectric structure has a second substrate, a signal layer and a photoelectric component. The photoelectric component is electrically connected to the signal line of the signal layer. One of the photoelectric structures straddles two adjacent first substrates. The third substrate is connected to the first substrate or the photoelectric structure. The driving units are distributed on the first substrate or the photoelectric structure, and the driving units correspondingly drive the photoelectric components of the photoelectric structures. The optoelectronic structures are electrically connected to the conductive layers via the first conductive structures, respectively.

公开(公告)号：US20200006404A1

公开(公告)日：2020-01-02

申请号：US16449929

申请日：2019-06-24

Applicant: GIO Optoelectronics Corp.

Inventor： Chin-Tang LI

IPC: H01L27/12

Abstract: An electronic device and manufacturing method of the electronic device are disclosed. The manufacturing method includes: providing a substrate; forming a thin film circuit on the substrate, wherein the thin film circuit comprises at least one thin film transistor and at least one conductive trace; forming at least one first connection pad on the substrate, wherein the first connection pad is electrically connected with the thin film transistor through the conductive trace; disposing the substrate on a driving circuit board, wherein the driving circuit board comprises at least one second connection pad adjacent to and corresponding to the first connection pad; and forming a conductive member covering at least a part of the second connection pad and the first connection pad, wherein the second connection pad is electrically connected with the first connection pad through the conductive member.

公开(公告)号：US20190124764A1

公开(公告)日：2019-04-25

申请号：US16135492

申请日：2018-09-19

Applicant: GIO Optoelectronics Corp

Inventor： Chin-Tang LI

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/40

Abstract: An electronic device and manufacturing method thereof are disclosed. The manufacturing method of the electronic device comprises following steps: forming at least a thin-film conductive line on the substrate by a thin-film process; forming at least an electrical connection pad on the substrate by a printing process, wherein the electrical connection pad is electrically connected with the thin-film conductive line; and disposing at least an electronic element on the substrate, wherein the electronic element is electrically connected with the thin-film conductive line through the electrical connection pad. The electronic device has a lower manufacturing cost and a higher component configuration density, and the production yield and reliability of the electronic device are improved by the configuration of the electrical connection pad.

公开(公告)号：US20200287112A1

公开(公告)日：2020-09-10

申请号：US16806296

申请日：2020-03-02

Applicant: GIO Optoelectronics Corp.

Inventor： Chin-Tang LI

IPC: H01L33/62 ,  H01L33/52 ,  H01L23/498 ,  H01L33/60

Abstract: A package structure and an electronic device including the package structure are disclosed. The package structure includes a substrate, a wire layer disposed on the substrate, a visual unit disposed on the substrate, and an encapsulation element disposed on the substrate. The wire layer includes a plurality of patterned circuits. The visual unit includes a first area and a second area defined along a periphery of the first area. The first area is configured with a photoelectric element, and the photoelectric element is electrically connected to and disposed corresponding to at least one of the patterned circuits. The encapsulation element completely covers the first area of the visual unit and overlaps the corresponding patterned circuit, such that an average reflectance inside the encapsulation element is greater than an average reflectance outside the encapsulation element.

公开(公告)号：US20220013513A1

公开(公告)日：2022-01-13

申请号：US17366710

申请日：2021-07-02

Applicant: GIO Optoelectronics Corp

Inventor： Chin-Tang LI

IPC: H01L25/16 ,  H01L27/12 ,  H01L23/538

Abstract: An electronic device includes a circuit board, a plurality of carrier boards, a plurality of photoelectric elements, and a plurality of driving elements. The circuit board has a first conductive layer. The carrier boards are arranged on the circuit board with a component distance in a direction. Each carrier board has a substrate and a second conductive layer. The second conductive layer is disposed on the substrate and electrically connected to the first conductive layer of the circuit board. The substrate defines a substrate area, and each photoelectric element defines an element area. The ratio of the substrate area to the element area is not less than 5. The driving elements are disposed on the circuit board or the carrier boards. The driving elements are electrically connected to the first conductive layer and the second conductive layers, and drive the photoelectric elements.

公开(公告)号：US20210265546A1

公开(公告)日：2021-08-26

申请号：US17262605

申请日：2020-05-20

Applicant: GIO Optoelectronics Corp

Inventor： Chin-Tang LI

IPC: H01L33/62 ,  H01L25/075

Abstract: An electronic device and a manufacturing method thereof are provided. The pattern circuit of each surface mount structure of the electronic device is disposed on the substrate; at least two through holes are respectively corresponding to at least two signal lines of the pattern circuit; and the two ends of at least one optoelectronic element are respectively electrically connected to at least two signal lines of the pattern circuit. Each connection pad group of the driving circuit board is corresponding to each surface mount structure, and at least two connection pads are respectively corresponding to the at least two through holes of the surface mount structure. At least two conductive members of each conductive member unit are disposed in the at least two through holes of the surface mount structure, respectively, and extending to the first surface and the second surface of the substrate. The conductive member disposed in each through hole electrically connects the signal lines of each surface mounting structure to the connection pads of each connection pad group of the driving circuit board.

公开(公告)号：US20200227391A1

公开(公告)日：2020-07-16

申请号：US16830859

申请日：2020-03-26

Applicant: GIO Optoelectronics Corp

Inventor： Chin-Tang LI

IPC: H01L25/075 ,  H01L33/62 ,  H01L27/12

Abstract: An electronic device comprises at least one sub matrix unit, a driving circuit board, and at least one surface mount device. The sub matrix unit comprises a substrate, thin-film circuits and first connecting pads. The thin-film circuits and the first connecting pads are disposed on the operation face of the substrate. The sub matrix unit defines a loading face and comprises second connecting pads, at least one first conductive line, and at least one second conductive line all together arranged on the loading face. A second height defined between a top of the surface mount device and the loading face of the driving circuit board is no less than a first height defined between an uppermost face of the sub matrix unit and the loading face of the driving circuit board.

公开(公告)号：US20190229133A1

公开(公告)日：2019-07-25

申请号：US16254967

申请日：2019-01-23

Applicant: GIO Optoelectronics Corp.

Inventor： Chin-Tang LI

IPC: H01L27/12 ,  H01L25/075 ,  H01L33/62

Abstract: A display apparatus and manufacturing method thereof are disclosed. The manufacturing method comprises: providing at least one sub-matrix unit, wherein each thin-film circuit comprises at least one thin-film transistor and at least one conductive line, the thin-film transistor is electrically connected with the conductive line, and the first connecting pads are electrically connected with the thin-film transistor through the conductive line; disposing the sub-matrix unit on a driving circuit board, wherein the second connecting pads are disposed facing to the first connecting pads and correspondingly connected to the first connecting pads, respectively, and the scan line and the data line are electrically connected with the corresponding first connecting pads through the second connecting pads; and disposing at least one surface mount device on the driving circuit board, wherein the surface mount device is electrically connected with the corresponding first connecting pads through the second connecting pads.