-
公开(公告)号:US12028668B2
公开(公告)日:2024-07-02
申请号:US17738015
申请日:2022-05-06
Inventor: Hsiao-Yi Lin , Kwun Kit Chan , Yi Feng Wei , Yao-Sheng Chou
IPC: H04R1/08
CPC classification number: H04R1/083 , H04R2201/003 , H04R2499/11
Abstract: A sound wave transducer is provided. The sound wave transducer includes a first board, a spacer layer and a second board over the first board and the spacer layer. The first board includes a carrier, a first substrate layer and a first metal layer. The carrier has a first opening formed in a central region. The first substrate layer is disposed on the carrier and over the first opening. The first metal layer is disposed on the first substrate layer. The spacer layer is disposed on the first board and surrounds the central region. The second board includes a second substrate layer, a second metal layer disposed on the spacer layer, and a plurality of second openings penetrating through the second substrate layer and the second metal layer.
-
公开(公告)号:US11622199B2
公开(公告)日:2023-04-04
申请号:US17521725
申请日:2021-11-08
Inventor: Yao-Sheng Chou , Kwun Kit Chan , Yi Feng Wei , Hsiao-Yi Lin
Abstract: A hybrid diaphragm structure is provided. The hybrid diaphragm structure includes a substrate, a first diaphragm disposed in a central region of the substrate, a first coil structure disposed over the first diaphragm, a first groove separating the first diaphragm and the first coil structure from the substrate, and a first bridge structure coupling the first diaphragm to the substrate. The first diaphragm and the substrate include a same material.
-