公开(公告)号：US20190267361A1

公开(公告)日：2019-08-29

申请号：US15907413

申请日：2018-02-28

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Md. Sayed Kaysar Bin Rahim ,  Luke England ,  Sukeshwar Kannan

IPC: H01L25/16 ,  H01L23/48 ,  H01L23/00 ,  H01L41/313 ,  H01L21/768 ,  H01L21/78 ,  H03H9/54 ,  H03H9/64 ,  H03H9/13 ,  H03H9/145 ,  H03H3/02 ,  H03H3/08

Abstract: A product disclosed herein includes an RF filter die including an RF filter, a front side and a plurality of conductive bond pads conductively coupled to at least a portion of the RF filter, wherein at least a portion of the conductive bond pads is exposed on the front side of the RF filter die. The product also includes a TSV (Through-Substrate-Via) die that includes a plurality of conductive TSV contacts positioned on a back side of the TSV die and at least one conductive TSV (Through-Substrate-Via) structure that is conductively coupled to at least one of the plurality of conductive TSV contacts, wherein the back side of the TSV die is bonded to the front side of the RF filter such that the conductive bond pads on the RF filter die are conductively coupled to corresponding conductive TSV contacts positioned on the back side of the TSV die.