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公开(公告)号:US20240008271A1
公开(公告)日:2024-01-04
申请号:US17977939
申请日:2022-10-31
Applicant: GenXComm, Inc.
Inventor: Brian Mattis , Taran Huffman , Bryan Woo , Thien-An Ngoc Nguyen
IPC: H01L27/11526 , G02B6/43 , G02B6/42
CPC classification number: H01L27/11526 , G02B6/43 , G02B6/4202 , G02B6/4277
Abstract: A semiconductor device includes a floating gate that can be charged in a nonvolatile manner. The floating gate is also structured as an optical waveguide, and may be optically coupled to a photonic circuit, such as an interferometer.
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公开(公告)号:US20240004133A1
公开(公告)日:2024-01-04
申请号:US18469710
申请日:2023-09-19
Applicant: GenXComm, Inc.
Inventor: Brian Mattis , Taran Huffman , Bryan Woo , Thien-An Nguyen
IPC: G02B6/136
CPC classification number: G02B6/136 , G02B2006/12061
Abstract: A method of co-manufacturing silicon waveguides, SiN waveguides, and semiconductor structures in a photonic integrated circuit. A silicon waveguide structure can be formed using a suitable process, after which it is buried in a cladding. The cladding is polished, and a silicon nitride layer is disposed to define a silicon nitride waveguide. The silicon nitride waveguide is buried in a cladding, and annealed. Thereafter, cladding above the silicon waveguide structure can be trenched through, and low-temperature operations can be performed to or with an exposed surface of the silicon waveguide structure.
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公开(公告)号:US11796737B2
公开(公告)日:2023-10-24
申请号:US17177798
申请日:2021-02-17
Applicant: GenXComm, Inc.
Inventor: Brian Mattis , Taran Huffman , Bryan Woo , Thien-An Nguyen
CPC classification number: G02B6/136 , G02B2006/12061 , G02B2006/12097 , G02B2006/12169 , G02B2006/12188 , G02B2006/12197
Abstract: A method of co-manufacturing silicon waveguides, SiN waveguides, and semiconductor structures in a photonic integrated circuit. A silicon waveguide structure can be formed using a suitable process, after which it is buried in a cladding. The cladding is polished, and a silicon nitride layer is disposed to define a silicon nitride waveguide. The silicon nitride waveguide is buried in a cladding, and annealed. Thereafter, cladding above the silicon waveguide structure can be trenched through, and low-temperature operations can be performed to or with an exposed surface of the silicon waveguide structure.
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