公开(公告)号：US4610758A

公开(公告)日：1986-09-09

申请号：US615261

申请日：1984-05-30

Applicant: Geoffrey C. Wilson

Inventor： Geoffrey C. Wilson

IPC: H05K3/00 ,  H05K3/06 ,  H05K3/24 ,  H05K3/34 ,  H05K3/42 ,  B05D5/12 ,  C23F1/02

CPC classification number: H05K3/3452 ,  H05K3/243 ,  H05K3/427 ,  H05K2201/0352 ,  H05K2201/2081 ,  H05K2203/0574 ,  H05K3/0094 ,  H05K3/062 ,  H05K3/242 ,  H05K3/244 ,  Y10S428/901 ,  Y10T29/49165

Abstract: A method of manufacture of a printed circuit board having plated-through holes interconnecting printed conductors formed on each of two external surfaces, includes the step of masking those areas of the external surfaces where solder will subsequently be required to adhere. The unmasked conductive areas are then coated with a material which prevents wetting by normal soldering techniques. The masking material is subsequently removed. The coating material may be electroless nickel, or electroplated nickel or suitable nickel alloys.

Abstract translation: 制造具有互连形成在两个外表面中的每一个上的印刷导体的具有电镀通孔的印刷电路板的方法包括掩蔽随后需要焊料粘附的外部表面的那些区域的步骤。 然后将未掩蔽的导电区域涂覆防止通过正常焊接技术润湿的材料。 随后除去掩蔽材料。 涂层材料可以是无电镍，或电镀镍或合适的镍合金。