公开(公告)号：US20140355931A1

公开(公告)日：2014-12-04

申请号：US14288680

申请日：2014-05-28

Applicant: Georgia Tech Research Corporation

Inventor： Rao R. Tummala ,  Chia-Te Chou ,  Venkatesh Sundaram

IPC: G02B6/122 ,  G02B6/136

CPC classification number: G02B6/43 ,  H05K1/0274 ,  H05K2201/09827

Abstract: An optical interposer that includes a glass substrate having one or more optical vias extending through the glass substrate. A first optical polymer may be bonded to the substrate and to interior surfaces of the one or more optical vias. Implementations include one or more optical via cores comprising a second optical polymer that has a greater refractive index than the first optical polymer. The one or more optical via cores may be at least partially surrounded by the first optical polymer. Embodiments include encapsulated optical waveguides in communication with the optical vias and/or via cores. Example implementations include layers of electrical insulation, electrical traces, and electrical vias. A method of manufacture includes forming the optical vias by laser ablation. Certain embodiments may include chemically etching the inside of the vias to improve surface roughness.

Abstract translation: 一种光学插入器，其包括具有延伸穿过玻璃基板的一个或多个光学通孔的玻璃基板。 第一光学聚合物可以结合到基底和一个或多个光学通孔的内表面。 实施方案包括一个或多个光学通孔芯，其包含具有比第一光学聚合物更大的折射率的第二光学聚合物。 一个或多个光学通孔芯可以至少部分地被第一光学聚合物包围。 实施例包括与光通孔和/或通孔芯通信的封装光波导。 示例实现包括电绝缘层，电迹线和电气通孔。 一种制造方法包括通过激光烧蚀形成光学通孔。 某些实施例可以包括化学蚀刻通孔内部以改善表面粗糙度。

公开(公告)号：US09417415B2

公开(公告)日：2016-08-16

申请号：US14288680

申请日：2014-05-28

Applicant: Georgia Tech Research Corporation

Inventor： Rao R. Tummala ,  Chia-Te Chou ,  Venkatesh Sundaram

IPC: G02B6/43 ,  G02B6/136 ,  H05K1/02

CPC classification number: G02B6/43 ,  H05K1/0274 ,  H05K2201/09827

Abstract: An optical interposer that includes a glass substrate having one or more optical vias extending through the glass substrate. A first optical polymer may be bonded to the substrate and to interior surfaces of the one or more optical vias. Implementations include one or more optical via cores comprising a second optical polymer that has a greater refractive index than the first optical polymer. The one or more optical via cores may be at least partially surrounded by the first optical polymer. Embodiments include encapsulated optical waveguides in communication with the optical vias and/or via cores. Example implementations include layers of electrical insulation, electrical traces, and electrical vias. A method of manufacture includes forming the optical vias by laser ablation. Certain embodiments may include chemically etching the inside of the vias to improve surface roughness.

Abstract translation: 一种光学插入器，其包括具有延伸穿过玻璃基板的一个或多个光学通孔的玻璃基板。 第一光学聚合物可以结合到基底和一个或多个光学通孔的内表面。 实施方案包括一个或多个光学通孔芯，其包含具有比第一光学聚合物更大的折射率的第二光学聚合物。 一个或多个光学通孔芯可以至少部分地被第一光学聚合物包围。 实施例包括与光通孔和/或通孔芯通信的封装光波导。 示例实现包括电绝缘层，电迹线和电气通孔。 一种制造方法包括通过激光烧蚀形成光学通孔。 某些实施例可以包括化学蚀刻通孔内部以改善表面粗糙度。