公开(公告)号：US10407300B2

公开(公告)日：2019-09-10

申请号：US15554652

申请日：2015-12-14

Applicant: Goertek.Inc

Inventor： Guoguang Zheng

IPC: B81B7/02 ,  G01L9/12 ,  G01P15/125 ,  G01P15/02 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  G01L19/04

Abstract: An integrated structure of an MEMS pressure sensor and an MEMS inertia sensor are provided, comprising: an insulating layer formed on a substrate, a first lower electrode and a second lower electrode both formed on the insulating layer, further comprising a first upper electrode forming an air pressure-sensitive capacitor together with the first lower electrode, and a second upper electrode forming a reference capacitor together with the second lower electrode; further comprising an inertia-sensitive structure supported above the substrate by a third support part, and a fixed electrode plate forming an inertia detecting capacitor of an inertia sensor together with the inertia-sensitive structure; and a cover body which packages the inertia detecting capacitor composed of the inertia-sensitive structure and the fixed electrode plate on the substrate.

公开(公告)号：US10805716B2

公开(公告)日：2020-10-13

申请号：US15554623

申请日：2015-12-10

Applicant: GOERTEK.INC

Inventor： Guoguang Zheng

IPC: H04R1/28 ,  H04R19/04 ,  H04R1/22 ,  H04R19/00

Abstract: The present invention discloses a package structure of a MEMS microphone. The package structure comprises a package substrate and a package shell, wherein the package shell is provided on the package substrate and forms a closed cavity with the package substrate. In the package structure provided by the present invention, the sound-absorbing layer is arranged on the inner wall of the Helmholtz resonant cavity. The sound-absorbing layer has a certain absorption capacity to high-frequency sound waves, but has a very low absorption to low-frequency sound waves, so it may be equivalent to a “low-pass filter”. Through the absorption of the high-frequency sound waves, a high-frequency amplitude value of sound waves can be suppressed, reducing high-frequency response of the Helmholtz resonant cavity. That is, a high-frequency cut-off frequency of the sound waves is improved, widening operation bandwidth of the MEMS microphone.

公开(公告)号：US10250962B2

公开(公告)日：2019-04-02

申请号：US15554980

申请日：2015-12-10

Applicant: GOERTEK.INC

Inventor： Guoguang Zheng

IPC: H04R1/04 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00

Abstract: The present invention discloses a package structure of a MEMS microphone. The package structure comprises a closed inner cavity formed by a package shell in a surrounding manner, as well as a MEMS chip and an ASIC chip which are located in the closed inner cavity, wherein a sound hole allowing sound to flow into the closed inner cavity is formed in the package shell; the MEMS chip comprises a substrate as well as a vibrating diaphragm and a back plate which are provided on the substrate; the vibrating diaphragm divides the closed inner cavity into a front cavity and a back cavity; and a sound-absorbing structure is provided in the back cavity.

公开(公告)号：US10295422B2

公开(公告)日：2019-05-21

申请号：US15559311

申请日：2015-12-10

Applicant: GOERTEK.INC

Inventor： Guoguang Zheng

IPC: G01L9/00 ,  G01L9/12 ,  G01L13/02 ,  G01L19/06

Abstract: The present invention discloses a quasi-differential capacitive MEMS pressure sensor and manufacturing methods thereof. The quasi-differential capacitive MEMS pressure sensor includes a first lower electrode, a second lower electrode, a first upper electrode supported above the first lower electrode, and a second upper electrode supported above the second lower electrode, wherein the first upper electrode is a pressure-sensitive film, and a cavity between the first upper electrode and the first lower electrode is a closed cavity, so that the first upper electrode and the first lower electrode constitute an air pressure-sensitive type capacitor; and the second upper electrode and the second lower electrode constitute a reference capacitor whose capacitance does not vary with external air pressure. The pressure sensor provided by the present invention can at least partially filter out a common-mode interference signal in an output signal of the air pressure-sensitive type capacitor by use of the reference capacitor, thereby improving the stability and resolution of the output signal of the air pressure-sensitive type capacitor.

公开(公告)号：US10145750B2

公开(公告)日：2018-12-04

申请号：US15572072

申请日：2015-12-10

Applicant: GOERTEK.INC

Inventor： Guoguang Zheng

IPC: G01L9/00 ,  G01L9/02 ,  G01L1/18 ,  G01L7/08 ,  G01L23/18 ,  G01L7/02

Abstract: An MEMS pressure sensing element is disclosed, comprising a substrate with a groove; a pressure-sensitive film on the substrate for sealing an opening of the groove to form a sealed cavity body; and a pressure-sensitive beam suspended in the sealed cavity body and parallel with the pressure-sensitive film provided with varistors, wherein a center of the pressure-sensitive beam is fixedly connected to that of the pressure-sensitive film, and a periphery is fixedly connected to a bottom wall of the groove of the substrate, such that the pressure-sensitive film drives the pressure-sensitive beam to bending deformation under an external pressure.