公开(公告)号：US10177055B2

公开(公告)日：2019-01-08

申请号：US15559780

申请日：2015-12-10

Applicant: Goertek.Inc

Inventor： Luyu Duanmu ,  Junde Zhang ,  Qinglin Song

IPC: H01L23/10 ,  B81B7/02 ,  H01L23/552 ,  B81B7/00

Abstract: Provided are an encapsulation structure and encapsulation method for an integrated sensor. The encapsulation structure comprises: a first substrate (1) and a first outer housing (2), the first outer housing and first substrate enclosing a first encapsulation cavity; a plurality of sensors arranged inside the first encapsulation cavity, each of the sensors comprising MEMS sensor chips (3, 8) and ASIC chips (5, 7) electrically connected to the MEMS sensor chips; inside the first encapsulation cavity, the exterior of the ASIC chip of at least one of the sensors is provided with a shielding structure. Arranging a shielding structure on the exterior of the ASIC chip in the integrated sensor and likely to be subjected to interference causes the ASIC chip to be encapsulated in isolation from other sensor units, preventing the other sensor units in the integrated sensor from interfering with the ASIC chip, and effectively improving the performance of the sensor unit and the overall performance of the integrated sensor.