公开(公告)号：US20170332161A1

公开(公告)日：2017-11-16

申请号：US15521151

申请日：2015-01-05

Applicant: Goertek.Inc

Inventor： Guanxun QIU ,  Qinglin SONG

IPC: H04R1/08 ,  H04R1/02 ,  H04R19/04

CPC classification number: H04R1/083 ,  H04R1/02 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

Abstract: The present invention discloses a microphone, comprises: a silicon substrate; a diaphragm disposed over the silicon substrate; a backplate disposed over the diaphragm, the backplate having a plurality of through holes formed therein and a barrier structure, and the plurality of through holes being arranged in a through hole pattern on the backplate; the barrier structure having one or more protruding portions extending from at least one part of the through hole wall of the barrier structure, thereby the section shape of at least one through hole being an irregular shape with one or more inwardly concave portion. The microphone provided by the present invention can achieve a better dustproof effect.