公开(公告)号：US06368697B1

公开(公告)日：2002-04-09

申请号：US09513418

申请日：2000-02-25

Applicant: Michael Petti ,  Gordon C. Smith

Inventor： Michael Petti ,  Gordon C. Smith

IPC: B32B300

CPC classification number: H05K3/0023 ,  H05K3/025 ,  H05K3/048 ,  H05K3/388 ,  H05K3/4652 ,  H05K2201/0108 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/2809 ,  Y10T428/2839

Abstract: A metal-clad laminate product including a carrier film, a release agent layer, a semi-transparent metal layer and a photo dielectric layer deposited on the conductive metal layer and a method for using the metal-clad laminate product to form an interlayer via by exposing at least a portion of an circuit board intermediate prepared from the metal-clad laminate product to light through the semi-transparent metal layer for a period of time sufficient to form an exposed or an unexposed photo dielectric portion and thereafter removing the exposed or unexposed portion of the photo dielectric layer and a corresponding portion of the semi-transparent metal layer overlying the exposed or unexposed portion of the photo dielectric layer to form an interlayer via.

Abstract translation: 包括载体膜，脱模剂层，半透明金属层和沉积在导电金属层上的光电介质层的覆金属层压制品以及使用覆金属层压制品通过以下方式形成夹层通孔的方法 将由覆金属层压制品制备的电路板中间体的至少一部分暴露于通过半透明金属层的光线上足以形成曝光或未曝光光电介质部分的时间，然后除去曝光或未曝光 光电介质层的一部分和半透明金属层的对应部分覆盖在光电介质层的暴露或未曝光部分上，以形成中间通孔。

公开(公告)号：US4431682A

公开(公告)日：1984-02-14

申请号：US388767

申请日：1982-06-15

Applicant: Gordon C. Smith ,  Richard F. Hayes ,  Carole G. Wendrovsky ,  Andre J. Eydt

Inventor： Gordon C. Smith ,  Richard F. Hayes ,  Carole G. Wendrovsky ,  Andre J. Eydt

IPC: A23G3/34 ,  A23G9/00 ,  A23G9/32 ,  A23G9/04

CPC classification number: A23G3/343 ,  A23G9/322 ,  A23G2200/00 ,  A23G2220/02

Abstract: A frozen, aerated cake frosting is prepared by pasteurizing and homogenizing a blend of sweeteners, water, fat, protein, emulsifiers and stabilizers, cooling and tempering the resulting emulsion and then whipping the tempered emulsion. Thereafter the whipped emulsion is combined with powdered sucrose at a weight ratio of 0.2 to 0.4:1 and the blend is frozen. The protein component is desirably a sodium-calcium caseinate complex having a sodium to calcium ratio of 0.25 to 1.0:1.

Abstract translation: 通过将甜味剂，水，脂肪，蛋白质，乳化剂和稳定剂的混合物巴氏消毒和均化来制备冷冻充气蛋糕结霜，冷却和回火所得乳液，然后搅拌回火乳液。 此后，将搅打的乳液与粉末状蔗糖以0.2至0.4：1的重量比组合，并将混合物冷冻。 蛋白质成分优选为钠钙比例为0.25〜1.0:1的酪蛋白酸钠配合物。

公开(公告)号：US06596391B2

公开(公告)日：2003-07-22

申请号：US09075732

申请日：1998-05-11

Applicant: Gordon C. Smith

Inventor： Gordon C. Smith

IPC: B32B1504

CPC classification number: B32B15/08 ,  B32B7/06 ,  B32B7/12 ,  B32B2307/202 ,  B32B2457/08 ,  H05K3/025 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0769 ,  H05K2203/0786 ,  Y10S428/901 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/265 ,  Y10T428/2804 ,  Y10T428/2839 ,  Y10T428/31678 ,  Y10T428/31692

Abstract: Disclosed is a metal-clad laminate product having a carrier film, a aqueous soluble release or parting layer deposited onto the carrier film and which can be mechanically separated from the carrier film, and an ultra thin metal layer deposited onto the parting layer. Also disclosed is a method for making the metal-clad laminate product.

公开(公告)号：US06702916B2

公开(公告)日：2004-03-09

申请号：US10283413

申请日：2002-10-29

Applicant: Gordon C. Smith

Inventor： Gordon C. Smith

IPC: B44L1165

CPC classification number: B32B7/06 ,  B32B15/08 ,  B32B37/025 ,  B32B38/18 ,  B32B2038/0092 ,  B32B2457/08 ,  H05K3/025 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/0769 ,  H05K2203/0786 ,  Y10T428/12438 ,  Y10T428/12569 ,  Y10T428/23986 ,  Y10T428/28 ,  Y10T428/2839 ,  Y10T428/31678

Abstract: Disclosed is a metal-clad laminate product having a carrier film, a aqueous soluble release or parting layer deposited onto the carrier film and which can be mechanically separated from the carrier film, and an ultra thin metal layer deposited onto the parting layer. Also disclosed is a method for making the metal-clad laminate product.

公开(公告)号：US6153721A

公开(公告)日：2000-11-28

申请号：US031286

申请日：1998-02-26

Applicant: Thomas F. McCarthy ,  David B. Schwind ,  Gordon C. Smith

Inventor： Thomas F. McCarthy ,  David B. Schwind ,  Gordon C. Smith

IPC: B32B27/04 ,  C07C39/17 ,  C08G59/62 ,  C08G61/02 ,  C08G85/00 ,  C08L63/00 ,  H05K1/03 ,  C07C37/16 ,  C08G59/14

CPC classification number: C08G61/02 ,  B32B27/04 ,  C07C39/17 ,  C08G59/621 ,  C08L63/00 ,  C07C2102/08 ,  H05K1/0326 ,  Y10T428/31511

Abstract: Novel polyindanebisphenols or PIBPs for the preparation of new and improved thermosetting polymers having the general formula of ##STR1## are provided. Also disclosed are thermoplastic or thermoset compositions prepared using the novel compounds of the invention, as well as methods of making and using the same. When copolymerized or reactive with other commercial resins such as, e.g., epoxy compounds, PIBP based polymers are characterized by high glass transition temperature ("Tg"), low dielectric constant, low moisture absorption, low coefficient of expansion, low cost, and can be processed on equipment typically used for the production of epoxy based laminates.

公开(公告)号：US6120693A

公开(公告)日：2000-09-19

申请号：US187642

申请日：1998-11-06

Applicant: Michael Petti ,  Gordon C. Smith

Inventor： Michael Petti ,  Gordon C. Smith

IPC: G03F7/40 ,  B32B15/08 ,  H05K3/00 ,  H05K3/02 ,  H05K3/04 ,  H05K3/38 ,  H05K3/46 ,  G03C5/00

CPC classification number: H05K3/0023 ,  H05K3/025 ,  H05K3/4652 ,  H05K2201/0108 ,  H05K3/048 ,  H05K3/388 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/2809 ,  Y10T428/2839

Abstract: A metal-clad laminate product including a carrier film, a release agent layer, a semi-transparent metal layer and a photo dielectric layer deposited on the conductive metal layer and a method for using the metal-clad laminate product to form an interlayer via by exposing at least a portion of an circuit board intermediate prepared from the metal-clad laminate product to light through the semi-transparent metal layer for a period of time sufficient to form an exposed or an unexposed photo dielectric portion and thereafter removing the exposed or unexposed portion of the photo dielectric layer and a corresponding portion of the semi-transparent metal layer overlying the exposed or unexposed portion of the photo dielectric layer to form an interlayer via.