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公开(公告)号：US20210176865A1
公开(公告)日：2021-06-10
申请号：US17110501
申请日：2020-12-03
Applicant: Guangdong University of Technology
Inventor： Chengqiang CUI , Guannan YANG , Guangdong XU , Yu ZHANG , Xin CHEN
Abstract: A method for repairing a fine line is provided. Nano metal particles are filled in a defect of a circuit board. The nano metal particles in the defect are irradiated by a laser, or heated, such that the nano metal particles in the defect are metallurgically bonded to an original line of the circuit board. A surface of the circuit board is cleaned to remove residual nano metal particles on parts of the circuit board where metallurgical bonding is not performed, thereby completing line repairing of the circuit board.
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