公开(公告)号：US20250022901A1

公开(公告)日：2025-01-16

申请号：US18714708

申请日：2022-09-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Nao INOUE ,  Shingo SHIMAI ,  Yosuke SUWA ,  Tatsuhiro KOMATSU

IPC: H01L27/146 ,  H01L25/00 ,  H01L25/065 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0224 ,  H01L33/36 ,  H01L33/56 ,  H01L33/62

Abstract: An optical semiconductor package includes a first chip, a second chip, a first resin portion formed to cover a side surface of the first chip, a second resin portion formed to cover a side surface of the second chip, a first terminal provided on a first inner surface of the first chip, a second terminal provided on a second inner surface of the second chip, and a first wiring electrically connected to the first terminal, passing through an inside of the first resin portion, and extending from a first inner surface side to a first outer surface side of the first chip in a facing direction in which the first inner surface and the second inner surface face each other. The second chip is an optical element. The first resin portion and the second resin portion are integrally provided or continuously provided via another member.