公开(公告)号：US20250050454A1

公开(公告)日：2025-02-13

申请号：US18718561

申请日：2022-08-22

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yo SUGIMOTO ,  Takafumi OGIWARA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/364 ,  B23K26/53 ,  B23K101/40

Abstract: A laser processing method includes: a step of forming a first groove in an object along a line by irradiating the object with laser light; a step of forming a second groove in the object along the line by irradiating the object with laser light, the second groove overlapping an end portion of the first groove in the width direction of the first groove; and a step of forming a modified region inside the object along the line by irradiating the object with laser light and extending a crack from the modified region after forming a composite groove including the first groove and the second groove in the object.

公开(公告)号：US20240051067A1

公开(公告)日：2024-02-15

申请号：US18266842

申请日：2021-12-20

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yo SUGIMOTO ,  Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Naoki UCHIYAMA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/351 ,  B23K26/064 ,  B23K26/04

CPC classification number: B23K26/351 ,  B23K26/064 ,  B23K26/048

Abstract: A laser processing method includes: a first step of preparing a wafer including a plurality of functional elements disposed to be adjacent to each other via a street; and a second step of, after the first step, irradiating the street with laser light based on information regarding the street such that a surface layer of the street is removed in a first region of the street and the surface layer remains in a second region of the street. The information regarding the street includes information indicating that, when a modified region is formed in the wafer along a line passing through the street, a fracture extending from the modified region does not reach the street along the line in the first region, and reaches the street along the line in the second region.

公开(公告)号：US20230185238A1

公开(公告)日：2023-06-15

申请号：US17917069

申请日：2021-02-17

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takashi KURITA ,  Yuu TAKIGUCHI

IPC: G03H1/22

CPC classification number: G03H1/2294 ,  G03H1/2286 ,  G03H2225/32

Abstract: A laser processing apparatus includes a spatial light modulator for inputting laser light output from a laser light source and outputting laser light after phase modulation by a hologram, and a control unit for presenting, on the spatial light modulator, the hologram for focusing the laser light after the phase modulation output from the spatial light modulator on a plurality of irradiation points in a processing object by a focusing optical system. The control unit sets at least one of a shape and a size of a processing region defined by the irradiation points in a first plane intersecting an optical axis of the laser light and a processing region defined by the irradiation points in a second plane intersecting the optical axis and separated from the first plane in a direction of the optical axis to be different from each other.

公开(公告)号：US20250025963A1

公开(公告)日：2025-01-23

申请号：US18715221

申请日：2022-08-22

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yo SUGIMOTO ,  Takafumi OGIWARA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/364

Abstract: A laser processing device includes a support unit, a laser light source, a spatial light modulator, and a condensing unit. A modulation pattern displayed on a display unit of the spatial light modulator includes a branching pattern for branching laser light into first branched laser light components to form a first groove and second branched laser light components to form a second groove. A distance between the position of the focusing point of the first branched laser light and the position of the focusing point of the second branched laser light adjacent to each other in a direction along the line is larger than a distance between the position of the focusing point of the first branched laser light and the position of the focusing point of the second branched laser light in the width direction of the first groove and the second groove.

公开(公告)号：US20240033859A1

公开(公告)日：2024-02-01

申请号：US18268383

申请日：2021-12-20

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yo SUGIMOTO ,  Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Naoki UCHIYAMA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/38 ,  B23K37/00

CPC classification number: B23K26/38 ,  B23K37/00

Abstract: A laser processing method includes a first step of preparing a wafer including a plurality of functional elements disposed to be adjacent to each other via a street, a second step of, after the first step, forming a modified region in the wafer along a line passing through the street, and a third step of, after the second step, irradiating the street with laser light such that a surface layer of the street is removed, and a fracture extending from the modified region reaches a bottom surface of a recess formed by removing the surface layer, along the line.

公开(公告)号：US20230226639A1

公开(公告)日：2023-07-20

申请号：US18007808

申请日：2021-06-04

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takashi KURITA ,  Takeshi WATARI ,  Yuki KABEYA ,  Ryo YOSHIMURA

IPC: B23K26/0622 ,  B23K26/356 ,  C21D10/00

CPC classification number: B23K26/0622 ,  B23K26/356 ,  C21D10/005

Abstract: A processed product manufacturing method includes preparing a workpiece containing metal and forming a plurality of first regions and a second region along a surface of the workpiece by the irradiation of a laser beam. The first regions are applied with a tensile residual stress. In the second region applied with a compressive residual stress, a plurality of irradiation points separated from each other in the surface of the workpiece are irradiated with the laser beam. The first regions are formed to be separated from each other and each of the first regions is surrounded by the second region when viewed from a direction orthogonal to the surface.

公开(公告)号：US20230143460A1

公开(公告)日：2023-05-11

申请号：US17917060

申请日：2021-02-17

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takashi KURITA ,  Yuu TAKIGUCHI

IPC: G02B5/32 ,  B23K26/06 ,  B23K26/03 ,  B23K26/067

CPC classification number: G02B5/32 ,  B23K26/0626 ,  B23K26/032 ,  B23K26/0673 ,  B23K26/0665

Abstract: A laser processing apparatus includes a spatial light modulator for inputting laser light output from a laser light source and outputting laser light after phase modulation by a hologram, and a control unit for presenting, on the spatial light modulator, the hologram for focusing the laser light after the phase modulation output from the spatial light modulator on a plurality of irradiation points in a processing object by a focusing optical system. The control unit controls light intensities of at least two irradiation points included in the plurality of irradiation points independently of each other.

公开(公告)号：US20230075209A1

公开(公告)日：2023-03-09

申请号：US17800043

申请日：2021-02-10

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takashi KURITA ,  Kazuki KAWAI

IPC: B23K26/064

Abstract: A laser processing apparatus includes a semiconductor laser element, a waveform output unit for outputting input waveform data, a driver circuit for supplying a drive current having a time waveform according to the input waveform data to the semiconductor laser element, and a processing optical system for irradiating a processing object with laser light. The semiconductor laser element outputs the laser light in which two or more light pulse groups each including one or a plurality of light pulses are provided with a time interval therebetween. Time waveforms of at least two light pulse are different from each other. The time waveform includes at least one of a time waveform of each of the one or plurality of light pulses, a time width of each of the one or plurality of light pulses, and a time interval of the plurality of light pulses.

公开(公告)号：US20180006423A1

公开(公告)日：2018-01-04

申请号：US15543375

申请日：2016-01-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takashi SEKINE ,  Yoshinori KATO ,  Yoshinori TAMAOKI ,  Takashi KURITA ,  Toshiyuki KAWASHIMA ,  Takaaki MORITA

IPC: H01S3/042 ,  H01S3/07 ,  H01S3/16 ,  H01S3/02 ,  H01S3/0941 ,  H01S3/06

CPC classification number: H01S3/10007 ,  H01S3/027 ,  H01S3/042 ,  H01S3/0604 ,  H01S3/07 ,  H01S3/092 ,  H01S3/0941 ,  H01S3/10 ,  H01S3/10092 ,  H01S3/137 ,  H01S3/1603 ,  H01S3/1643 ,  H01S2301/02

Abstract: A laser medium unit 10 in a laser beam amplification device includes a plurality of laser media 14. A cooling medium flow path F1 is provided around the laser medium unit 10 to cool the laser medium unit 10 from outside. A sealed space between the laser media 14 is filled with gas or liquid, and a laser beam for passing through the sealed space is not interfered by a cooling medium flowing outside. Therefore, a fluctuation of an amplified laser beam is prevented, and a quality such as stability and focusing characteristics of the laser beam is improved.

公开(公告)号：US20250105011A1

公开(公告)日：2025-03-27

申请号：US18726138

申请日：2022-08-22

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yo SUGIMOTO ,  Takafumi OGIWARA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: H01L21/268

Abstract: A laser processing method including: a first step of preparing a wafer having a first region and a second region; a second step of irradiating the street with a predetermined first laser beam; and a third step of irradiating the street with a predetermined second laser beam after the second step, the first laser beam being a laser beam having processing energy for removing a part of the insulating film in the first region to leave the other part, completely removing the metal structure in the second region, and removing a part of the insulating film in the second region to leave the other part, and the second laser beam being a laser beam having processing energy for completely removing the insulating film in the first region and the insulating film in the second region after the second step.