公开(公告)号：US20190084089A1

公开(公告)日：2019-03-21

申请号：US16082982

申请日：2017-03-10

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yasunori IGASAKI ,  Aiko NAKAGAWA ,  Takeshi YAMADA

IPC: B23K26/38 ,  B23K26/03 ,  B23K26/04 ,  B23K26/06 ,  B23K26/08 ,  B23K26/402 ,  B23K26/70

Abstract: A laser machining device includes a laser light source, a spatial light modulator which includes a display unit, an objective lens, an image-transfer optical system, a camera and a controller. The controller executes first display processing and second display processing. According to first display processing, when the camera captures the image, the display unit displays a first phase pattern for adjusting a condensing position of laser light condensed by the objective lens to a first condensing position. According to second display processing, when the camera captures the image, the display unit displays a second phase pattern for adjusting the condensing position of the laser light condensed by the objective lens to a second condensing position different from the first condensing position in an irradiation direction of the laser light.

公开(公告)号：US20150217399A1

公开(公告)日：2015-08-06

申请号：US14422367

申请日：2013-08-01

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yoko TAJIKARA ,  Takeshi YAMADA

IPC: B23K26/00 ,  B28D5/00

CPC classification number: B23K26/53 ,  B23K26/0006 ,  B23K26/0622 ,  B23K26/083 ,  B23K26/0869 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  C03B33/0222 ,  C03B33/033 ,  C03B33/07 ,  C03B33/074 ,  Y10T225/12

Abstract: The object cutting method comprises a step of locating a converging point of laser light within a monocrystal sapphire substrate, while using a rear face of the monocrystal sapphire substrate as an entrance surface of the laser light, and relatively moving the converging point along each of a plurality of lines to cut set parallel to the m-plane and rear face of the substrate, so as to form a modified region within the substrate along each line and cause a fracture to reach a front face. In this step, t−[(d/2)−m]/tan α

Abstract translation: 物体切割方法包括将单晶蓝宝石基板中的激光的会聚点定位在单晶蓝宝石基板的背面，同时使用单晶蓝宝石基板的背面作为激光的入射面，并且使会聚点沿着 要平行于基板的m面和背面设置的多条切割线，以便沿着每条线在基板内形成改质区域，并使断裂达到正面。 在该步骤中，满足t - [（d / 2）-m] /tanα