公开(公告)号：US20150098169A1

公开(公告)日：2015-04-09

申请号：US14162332

申请日：2014-01-23

Applicant: HAMILTON SUNDSTRAND CORPORATION

Inventor： ERIC KARLEN ,  JOHN HOROWY

IPC: H02G5/00

CPC classification number: H01B1/026 ,  H01B1/02 ,  H01B1/023 ,  H01L2224/83101 ,  H05K7/209 ,  H05K2201/10272

Abstract: A power distribution system element formed via an additive manufacturing technique, such as applying a conductive material to a memory metal substrate, are discussed herein. In operation (e.g. in response to delivering current through the distribution system), the memory metal contracts while the conductive material expands. The result is distribution system element having reduced thermal expansion, which can be net zero coefficient of thermal expansion.

Abstract translation: 这里讨论了通过添加剂制造技术形成的配电系统元件，例如将导电材料施加到存储金属衬底。 在操作中（例如，响应于通过分配系统传送电流），存储金属在导电材料膨胀的同时收缩。 结果是具有减小的热膨胀的分配系统元件，其可以是净零热膨胀系数。