中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

11 records (took 0.011 seconds)

    LIGHTING FIXTURE WITH THREADLESS FIT
    2.
    发明公开
    LIGHTING FIXTURE WITH THREADLESS FIT 审中-公开

    公开(公告)号：US20240117957A1

    公开(公告)日：2024-04-11

    申请号：US18232335

    申请日：2023-08-09

    Applicant: HANGZHOU HPWINNER OPTO CORPORATION

    Inventor： Jianming HUANG ,  Kai CHEN ,  Ming XU ,  Mingzhi GAO ,  Takeshi TAKANO

    IPC: F21V17/16 ,  F21V31/00

    CPC classification number: F21V17/164 ,  F21V31/005

    Abstract: Disclosed herein is a lighting fixture in which a threadless fit is achieved between a lens cover and a housing. The lighting fixture comprises a housing, a circuit board and a lens cover. The housing and the lens cover are arranged on opposite sides of the circuit board. The housing comprises a first slot. The lens cover comprises a first tab configured to fit into the first slot by a threadless fit, thereby securing the lens cover to the housing. Compared with lighting fixtures in the prior art, the lighting fixture of the present disclosure can save process steps, simplify manufacturing process, reduce manufacturing cost, and improve heat dissipation and light distribution efficiency.

    LIGHT EMITTING DIODE ASSEMBLY AND PLANT LIGHTING FIXTURE
    3.
    发明公开
    LIGHT EMITTING DIODE ASSEMBLY AND PLANT LIGHTING FIXTURE 审中-公开

    公开(公告)号：US20240027038A1

    公开(公告)日：2024-01-25

    申请号：US18125721

    申请日：2023-03-23

    Applicant: HANGZHOU HPWINNER OPTO CORPORATION

    Inventor： Jianming HUANG ,  Kai CHEN

    IPC: F21S4/28 ,  F21V19/00 ,  F21V5/00 ,  F21V31/00

    CPC classification number: F21S4/28 ,  F21V19/0045 ,  F21V5/007 ,  F21V31/005

    Abstract: An LED assembly includes a substrate, an LED module mounted on the substrate, and a lens plate disposed on the substrate. The lens plate has a lens portion disposed atop the LED module and defining a space between an inner surface of the lens portion and the LED module. A filler material having a refractive index greater than air fills the space between the LED module and the inner surface of the lens portion. The LED module includes a chip holder mounted on the substrate, a red LED chip mounted on the chip holder, and an optical encapsulant covering the top surface of the LED chip. The LED module is a plastic leaded chip carrier package. The refractive index of the filler material preferably differs from the refractive index of the optical encapsulant by at most ±0.3.

    LIGHTING MODULE AND LIGHTING DEVICE
    4.
    发明申请
    LIGHTING MODULE AND LIGHTING DEVICE 有权

    公开(公告)号：US20210356112A1

    公开(公告)日：2021-11-18

    申请号：US17337523

    申请日：2021-06-03

    Applicant: HANGZHOU HPWINNER OPTO CORPORATION

    Inventor： Jianming HUANG ,  Kai CHEN

    IPC: F21V31/00 ,  F21V29/74 ,  F21V3/00

    Abstract: A lighting module and a lighting device. The lighting module includes: a base, including a bottom plate and a base sidewall disposed on the bottom plate, the base sidewall and the bottom plate enclosing an accommodation groove; a light transmitting component, being partially disposed in the accommodation groove so as to form an accommodating space between the light transmitting component and the bottom plate, the light transmitting component including a light transmitting component sidewall which is oppositely arranged with the base sidewall at an interval; and a sealing component, being partially disposed between the light transmitting component sidewall and the base sidewall, and being in close contact with the light transmitting component sidewall and the base sidewalls respectively so as to seal the accommodating space.

    LIGHTING MODULE AND LIGHTING DEVICE
    5.
    发明申请
    LIGHTING MODULE AND LIGHTING DEVICE 有权

    公开(公告)号：US20210381686A1

    公开(公告)日：2021-12-09

    申请号：US17335304

    申请日：2021-06-01

    Applicant: HANGZHOU HPWINNER OPTO CORPORATION

    Inventor： Jianming HUANG ,  Kai CHEN

    IPC: F21V31/00 ,  F21V23/00 ,  F21V29/70

    Abstract: A lighting module and a lighting device are disclosed. The lighting module includes a base, a light-transmitting component and a sealing component, the base includes a bottom plate and a base sidewall, the light-transmitting component includes a light-transmitting component includes a light-transmitting component body and a light-transmitting component sidewall; the bottom plate and the light-transmitting component body are disposed opposite to each other to form an accommodation space between the bottom plate and the light-transmitting component body; the base sidewall and the light-transmitting component sidewall are disposed opposite to each other in a direction parallel to the base plate; the sealing component is located between the base sidewall and the light-transmitting component sidewall, and is in close contact with the light-transmitting component sidewall and the base sidewall, respectively, so as to seal the accommodation space.

    An LED Module and its Manufacturing Process
    7.
    发明申请
    An LED Module and its Manufacturing Process 有权
    LED模块及其制造工艺

    公开(公告)号：US20160126427A1

    公开(公告)日：2016-05-05

    申请号：US14893432

    申请日：2013-06-17

    Applicant: HANGZHOU HPWINNER OPTO CORPORATION

    Inventor： Kai CHEN ,  Jianming HUANG

    IPC: H01L33/48 ,  F21K99/00 ,  H01L33/64 ,  H01L33/56 ,  H01L33/50

    CPC classification number: H01L33/486 ,  F21K9/00 ,  F21K9/90 ,  F21V29/74 ,  H01L33/507 ,  H01L33/56 ,  H01L33/58 ,  H01L33/647

    Abstract: The present invention relates to the technical field of illuminating lamp, especially to an LED module and its manufacturing process. The LED module of the present invention includes a lens group, an LED illuminant, a circuit board and a heat sink; the LED illuminant includes an LED chip and a heat sink holder; the LED chip is attached to the heat sink holder which is disposed on the circuit board by Surface Mounted Technology; the lens group covers the heat sink, and is located above the LED chip; encapsulant is filled in a confined space formed between the lens group and the heat sink through a process of injection. Compared with the prior art, in the LED module of the present invention, the encapsulant replaces the original air medium in the transmission process of the light emitted by the LED chip; moreover, the matching between the refractive index of the encapsulant and the lens of the lens group improves the light out-coupling efficiency to greatest extent. Lighting efficiency is improved by 10˜15% compared with the prior art.

    Abstract translation: 本发明涉及照明灯的技术领域，特别涉及LED模块及其制造工艺。 本发明的LED模块包括透镜组，LED光源，电路板和散热器; LED光源包括LED芯片和散热器支架; LED芯片通过表面贴装技术安装在设置在电路板上的散热器支架上; 镜头组覆盖散热器，位于LED芯片上方; 密封剂通过注射过程填充在透镜组和散热器之间形成的密闭空间中。 与现有技术相比，在本发明的LED模块中，在由LED芯片发射的光的透射过程中，密封剂取代原来的空气介质; 此外，密封剂的折射率和透镜组的透镜之间的匹配最大程度地提高了光输出耦合效率。 照明效率比现有技术提高了10〜15％。

    Light-Emitting Diode Lighting Module
    8.
    发明申请
    Light-Emitting Diode Lighting Module 审中-公开

    公开(公告)号：US20190128501A1

    公开(公告)日：2019-05-02

    申请号：US16307737

    申请日：2017-06-07

    Applicant: HANGZHOU HPWINNER OPTO CORPORATION

    Inventor： Kai CHEN ,  Jianming HUANG

    IPC: F21V5/04 ,  H01L33/52 ,  G02B7/02 ,  F21V19/00 ,  H05K1/02

    Abstract: A light-emitting diode lighting module, including: a base, provided with a mounting surface; at least one light-emitting diode element, on the mounting surface of the base, each of the at least one light-emitting diode element including a plurality of light-emitting diode dies packaged together; and a lens assembly, disposed on a side of the base provided with the at least one light-emitting diode element, and forming an accommodating space with the base, wherein the at least one light-emitting diode element is located in the accommodating space, and the lens assembly includes a lens supporting portion and at least one lens portion in one-to-one correspondence with the at least one light-emitting diode element, each of the at least one lens portion is disposed on a corresponding light-emitting diode element to achieve light distribution of the corresponding light-emitting diode element, and the lens supporting portion is connected with the at least one lens portion to support the at least one lens portion.

    LED Module Sealing Technology
    9.
    发明申请
    LED Module Sealing Technology 审中-公开

    公开(公告)号：US20170373483A1

    公开(公告)日：2017-12-28

    申请号：US15695709

    申请日：2017-09-05

    Applicant: Hangzhou HPWinner Opto Corporation

    Inventor： Kai CHEN ,  Jianming HUANG ,  Huali LU

    IPC: H02G15/013 ,  H01R12/53 ,  F21V31/00 ,  F21V27/02 ,  H02G3/22 ,  H01R4/56 ,  F21Y2115/10

    CPC classification number: H02G15/013 ,  F21V27/02 ,  F21V31/005 ,  F21Y2115/10 ,  H01R4/56 ,  H01R12/53 ,  H01R13/5205 ,  H01R13/5804 ,  H02G3/22

    Abstract: A sealing process of LED modules, comprising: (1) a waterproof wire goes through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, wherein the positive-negative solder joint and the position that the waterproof wire going through are subjected to glue sealing treatment, and a waterproof sealing process is operated between the waterproof wire and the wire-through hole; (2) fix the PCB board on the heat sink; (3) place one sealing ring into one of the grooves; (4) apply evenly a ring of liquid silica gel along the other groove of the lens set and the amount of the liquid silica gel is limited to completely sticking the solid silica gel sealing ring; (5) the heat sink installed with the PCB board and the waterproof wire as processed in step (2) is inversely buckled on the lens set which is set with the solid silica gel ring and the liquid silica gel as processed in step (4), so as to fix the heat sink entirety and the lens set. At least two waterproof sealing rings are used for completely isolating an LED chip from the outside so as to prevent all water vapor or other harmful gases from corroding the chip and the PCB, and the sealing rings are firmer when being compared with thin film sealing; the service life is longer and the guarantees to the sealing performance between the lens set and the heat radiation frame are realized.

Patent Agency Ranking