公开(公告)号：US20230286799A1

公开(公告)日：2023-09-14

申请号：US18019447

申请日：2021-09-23

Applicant: HARBIN INSTITUTE OF TECHNOLOGY, SHENZHEN

Inventor： Yonggang ZHU ,  Chaozhan CHEN ,  Huaying CHEN ,  Bin RAN ,  Bo LIU ,  Chuanwen LV

IPC: B81C99/00

CPC classification number: B81C99/0085 ,  B81C2201/034 ,  B33Y80/00

Abstract: Disclosed in the present disclosure is a manufacturing method for a 3D microelectrode. The manufacturing method includes the following steps: (1) manufacturing a 3D model of a 3D microelectrode; (2) pouring a flexible material into the 3D model, and performing demolding so as to form a flexible mold having a cavity, wherein the cavity of the flexible mold can be fitted to the 3D model; (3) performing silanization treatment on the flexible mold, then pouring a flexible material into the surface of the flexible mold having the cavity, and performing demolding so as to form a flexible 3D microelectrode substrate; and (4) manufacturing a conductive layer on the flexible 3D microelectrode substrate so as to form the 3D microelectrode. In the present disclosure, a 3D microelectrode having an ultrahigh microcolumn height can be manufactured by using a 3D printing technology and a two-time mold-reversing method.