公开(公告)号：US09661753B1

公开(公告)日：2017-05-23

申请号：US15366158

申请日：2016-12-01

Applicant: HARRIS CORPORATION

Inventor： Gregory M. Jandzio ,  Brinnan C. Riley ,  Charlie Dull ,  Jason Naylor

IPC: H01R9/00 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/182 ,  H05K3/34 ,  H05K3/3426 ,  H05K2201/10287 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/2027 ,  Y02P70/611 ,  Y02P70/613

Abstract: Microclip appliance formed from a single conductive planar metal sheet includes portions defined along an elongated length including a pin receiver, a solder paddle and a bridge. The pin receiver includes first and second planar rings, and a spring bar extending from a periphery of the first ring to a periphery of the second ring. The solder paddle is comprised of a portion of the conductive metal sheet distal from the pin receiver and the bridge extends from a peripheral portion of the solder paddle to the second ring. Lateral bends are disposed along a length of the conductive planar metal sheet to facilitate the various portions of the microclip.