公开(公告)号：US20180206325A1

公开(公告)日：2018-07-19

申请号：US15407012

申请日：2017-01-16

Applicant: HARRIS CORPORATION

Inventor： John R. McINTYRE ,  Kevin DELL ,  Timothy W. BURKS

IPC: H05K1/02 ,  H05K7/20 ,  H05K3/30

CPC classification number: H05K1/0209 ,  H05K1/0224 ,  H05K7/205 ,  H05K2201/0715 ,  H05K2201/10416

Abstract: An electronic device may include a circuit board, an IC carried by the circuit board, and an RF shield above the IC. The circuit board may include a dielectric layer, and a thermally conductive body in the dielectric layer. The thermally conductive body may have a first heat transfer surface coupled to the IC. The thermally conductive body may extend laterally within the dielectric layer and outward past the RF shield and defining a second heat transfer surface. The electronic device may include a heat sink coupled to the second heat transfer surface.