公开(公告)号：USD940664S1

公开(公告)日：2022-01-11

申请号：US29743322

申请日：2020-07-21

Applicant: Harting AG

Designer： Thomas Hess

公开(公告)号：USD937785S1

公开(公告)日：2021-12-07

申请号：US29743320

申请日：2020-07-21

Applicant: Harting AG

Designer： Thomas Hess

公开(公告)号：US11770896B2

公开(公告)日：2023-09-26

申请号：US17760259

申请日：2021-02-04

Applicant: HARTING AG

Inventor： Thomas Hess

IPC: H05K1/14 ,  H05K3/34 ,  H05K1/11

CPC classification number: H05K1/119 ,  H05K1/141 ,  H05K3/341 ,  H05K2201/09118 ,  H05K2201/10568

Abstract: Disclosed are special component carriers made of MID-capable plastic in order to make the geometric arrangement of electrical components, such as microprocessors, LEDs, sensors, antennas and the like, on a circuit board more flexible. Said component carriers can have a standardized footprint for connecting to the circuit board and can be adapted to the terminals and the geometric arrangement of the components using individually applied conducting tracks, in particular in an LDS process. Furthermore, the specially shaped component carriers allow the electrical components to be geometrically oriented, in particular at a right angle to the circuit board and parallel to the circuit board, which is especially highly advantageous for antennas and acceleration sensors. Furthermore, SMT soldering is made possible in the pre-mounted state even for temperature-sensitive components.

公开(公告)号：USD943535S1

公开(公告)日：2022-02-15

申请号：US29743326

申请日：2020-07-21

Applicant: Harting AG

Designer： Thomas Hess