INTEGRATED CO-FIRED INDUCTOR AND PREPARATION METHOD THEREFOR

    公开(公告)号:US20240006121A1

    公开(公告)日:2024-01-04

    申请号:US18255537

    申请日:2021-10-12

    CPC classification number: H01F41/0246 H01F1/24 H01F27/2823 H01F41/005

    Abstract: An integrated co-fired inductor and preparation method therefor, comprising: filling a mold cavity with a magnetic powder, embedding at least one wire in the magnetic powder, wherein the two ends extend out of the mold cavity, sequentially performing compression molding and heat treatment to obtain a magnetic core, and bending and tinning the wire extending out of the magnetic core to obtain the co-fired inductor. The preparation method uses an integrated mold forming process to prepare the inductor to avoid an assembly process involving an excessive number of components; heat treatment is performed after the integral forming process, stress is fully released, material hysteresis loss is reduced, and the loss of the device under light load conditions is reduced; no extra gap exists between the wire and the magnetic core, air gaps are uniformly distributed within the magnetic core, and the vibration noise of eddy current loss is reduced.

    INTEGRATED CO-FIRED INDUCTOR AND PREPARATION METHOD THEREFOR

    公开(公告)号:US20240029952A1

    公开(公告)日:2024-01-25

    申请号:US18255538

    申请日:2021-11-24

    CPC classification number: H01F41/0246 H01F27/255 H01F27/2823

    Abstract: An integrated co-fired inductor and preparation method therefor, comprising: batch filling a magnetic powder in the mold cavity, embedding at least one wire into one layer of the magnetic powder, the two ends of the wire extending out of the mold cavity, sequentially performing compression molding and heat treatment to obtain a magnetic core, and bending and tinning the wire to obtain the co-fired inductor. The preparation method uses an integrated mold forming process to prepare the inductor to avoid an assembly process involving an excessive number of components; heat treatment is performed after the integral forming process, stress is fully released, material hysteresis loss is reduced, and the loss of the device under light load conditions is reduced; no extra gap exists between the wire and the magnetic core, air gaps are uniformly distributed within the magnetic core, and the vibration noise of eddy current loss is reduced.

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