公开(公告)号：US11153992B2

公开(公告)日：2021-10-19

申请号：US16716573

申请日：2019-12-17

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir Cader ,  Wade D Vinson ,  Douglas Kent Garday ,  John P Franz

IPC: H05K7/20 ,  H05K7/14 ,  G06F1/20

Abstract: An apparatus is provided herein. The apparatus includes a sensor module and a control module. The sensor module to receive a measured environmental condition. The control module to use the measured environmental condition to determine a fluid temperature to cool a first set of components and determine an air temperature to cool a second set of components.

公开(公告)号：US10455726B2

公开(公告)日：2019-10-22

申请号：US15511983

申请日：2014-09-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir Cader ,  John P Franz ,  David Allen Moore ,  Douglas Kent Garday ,  Wade D Vinson

IPC: H05K7/20 ,  G06F1/20

Abstract: A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.

公开(公告)号：US10136544B2

公开(公告)日：2018-11-20

申请号：US15315380

申请日：2014-07-08

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Norton ,  Melvin K Benedict ,  John P Franz

IPC: H01R12/00 ,  H05K7/14 ,  H05K7/20 ,  H01R12/73 ,  H01R13/629

Abstract: A dual in-line memory module (DIMM) connector can include a double data rate fourth generation (DDR4) DIMM connector to connect to a DIMM via a lowest notch of the DIMM relative to an electronic component on which the DIMM is located.

公开(公告)号：US20160270260A1

公开(公告)日：2016-09-15

申请号：US15033111

申请日：2014-01-06

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John P Franz

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20781

Abstract: An example device in accordance with an aspect of the present disclosure includes a dripless connector that has a base and an extension. A manifold is to slidably mount the dripless connector. The base of the dripless connector is slidable, relative to the manifold, along a floating direction substantially non-parallel to an engagement direction of the extension of the dripless connector.

Abstract translation: 根据本公开的一个方面的示例性装置包括具有基座和延伸部的无滴漏连接器。 歧管是可滑动地安装无滴漏连接器。 无滴灌连接器的基座相对于歧管可沿着基本上不平行于无滴灌连接器的延伸部的接合方向的浮动方向滑动。

公开(公告)号：US10548242B2

公开(公告)日：2020-01-28

申请号：US15329246

申请日：2014-07-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir Cader ,  Wade D Vinson ,  Douglas Kent Garday ,  John P Franz

IPC: H05K7/20 ,  G06F1/20 ,  H05K7/14

Abstract: A system to cool a module data center including a fluid cooling device to cool a first set of components of the module data center using a fluid cooling loop and an air cooling device to provide an air to cool a second set of components of the module data center. Also, a control apparatus to determine an air cooling temperature for the air cooling loop based on an environmental condition, determine a fluid cooling temperature for the fluid cooling loop based on the environmental condition, transmit an air signal to the air cooling device to set the air cooling temperature, and transmit a fluid signal to the fluid cooling device to set the fluid cooling temperature.

公开(公告)号：US10512195B2

公开(公告)日：2019-12-17

申请号：US15522634

申请日：2014-10-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John P Franz ,  Tahir Cader

IPC: H05K7/20 ,  H05K1/14 ,  H05K7/14

Abstract: Example implementations relate to a server device with a capacitive circuit. For example, a server device with a capacitive circuit can include a capacitive circuit located on a printed circuit assembly (PCA) of the server device and a baseboard management controller unit (BMC) to provide a communication interface between the capacitive circuit and a computing device. A voltage can be applied across the capacitive circuit and a signal can be sent from the capacitive circuit to the computing device using the BMC in response to a change in voltage.

公开(公告)号：US10356957B2

公开(公告)日：2019-07-16

申请号：US15523674

申请日：2014-10-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John P Franz ,  Tahir Cader

IPC: H05K7/04 ,  H05K7/14 ,  H05K7/20

Abstract: Example implementations relate to an adaptive cooling assembly. For example, an adaptive cooling assembly includes a removable shelf installed in the adaptive cooling assembly, an adaptive cooling bay located in a slot formed by the removable shelf, and a removable thermal bus bar installed in the adaptive cooling bay and connected to a pair of connectors. The adaptive cooling bay includes the pair of connectors and the removable thermal bus bar provides liquid cooling to an electronic device.