公开(公告)号：US20200003971A1

公开(公告)日：2020-01-02

申请号：US16023596

申请日：2018-06-29

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Ashkan Seyedi ,  Marco Florentino ,  Geza Kurczveil ,  Raymond G. Beausoleil

IPC: G02B6/42 ,  G02B6/32 ,  G02B6/30 ,  G02B6/124 ,  G02B6/34 ,  G02B6/12 ,  H01S5/0683

Abstract: Processes and apparatuses described herein reduce the manufacturing time, the cost of parts, and the cost of assembly per laser for photonic interconnects incorporated into computing systems. An output side of a laser assembly is placed against an input side of a silicon interposer (SiP) such that each pad in a plurality of pads positioned on the output side of the laser assembly is in contact with a respective solder bump that is also in contact with a corresponding pad positioned on the input side of the SiP. The laser assembly is configured to emit laser light from the output side into an input grating of the SiP. The solder bumps are heated to a liquid phase. Capillary forces of the solder bumps realign the laser assembly and the SiP while the solder bumps are in the liquid phase. The solder bumps are then allowed to cool.

公开(公告)号：US20190068292A1

公开(公告)日：2019-02-28

申请号：US15768975

申请日：2015-10-29

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Kehan Zhu ,  Cheng Li ,  Marco Florentino

IPC: H04B10/69 ,  H04B10/25 ,  H04L25/49

CPC classification number: H04B10/6931 ,  H04B10/25 ,  H04B10/2507 ,  H04B10/693 ,  H04L25/4917

Abstract: One example of a receiver includes a first stage, a second stage, a third stage, and an automatic gain controller. The first stage amplifies an input signal to provide a first signal. The second stage amplifies or attenuates the first signal to provide a second signal based on a tunable gain of the second stage. The tunable gain is adjusted in response to a differential signal. The third stage amplifies the second signal to provide an output signal. The automatic gain controller provides the differential signal based on a comparison between a peak voltage of the output signal and the sum of a common mode voltage of the output signal and an offset voltage.

公开(公告)号：US10209445B2

公开(公告)日：2019-02-19

申请号：US15976944

申请日：2018-05-11

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Di Liang ,  David A. Fattal ,  Marco Florentino ,  Zhen Peng ,  Charles M. Santori ,  Raymond G. Beausoleil

IPC: G02B6/34 ,  G02B6/122 ,  H01S5/10 ,  B82Y20/00 ,  G02B6/125 ,  H01S5/125 ,  G02B6/12 ,  H01S5/12

Abstract: Compact photonics platforms and methods of forming the same are provided. An example of a compact photonics platform includes a layered structure having an active region along a longitudinal axis, a facet having an angle no less than a critical angle formed at at least one longitudinal end of the active region, and a waveguide having at least one grating coupler positioned in alignment with the angled facet to couple light out to or in from the waveguide.