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公开(公告)号：US20210043270A1
公开(公告)日：2021-02-11
申请号：US16965127
申请日：2018-04-11
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： KUAN-TING WU , YA-TING YEH , CHAO-WEN CHENG , HSIN-YI LEE
Abstract: In one example, a device housing is described, which may include a base substrate and ion-exchanged glass beads disposed on an outer surface of the base substrate.
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