Printed circuit board
    1.
    发明授权

    公开(公告)号:US10701799B2

    公开(公告)日:2020-06-30

    申请号:US15546617

    申请日:2015-03-31

    Abstract: According to an example, a device may comprise a printed circuit board. The printed circuit board may further comprise a first layer and a second layer. The first layer may comprise a first material and the second layer may comprise a second material. In some examples, the first layer may further comprise at least one mounting hole surrounded by a third material at a thickness equal to a thickness of the first layer, and the first material may be electrically isolated from the third material. In some examples, the printed circuit board may be mated to a light guide assembly for a touchscreen system.

    PRINTED CIRCUIT BOARD
    2.
    发明申请

    公开(公告)号:US20180027650A1

    公开(公告)日:2018-01-25

    申请号:US15546617

    申请日:2015-03-31

    Abstract: According to an example, a device may comprise a printed circuit board. The printed circuit board may further comprise a first layer and a second layer, The first layer may comprise a first material and the second layer may comprise a second material. In some examples, the first layer may further comprise at least one mounting hole surrounded by a third material at a thickness equal to a thickness of the first layer, and the first material may be electrically isolated from the third material, In some examples, the printed circuit board may be mated to a light guide assembly for a touchscreen system.

Patent Agency Ranking